K.B. Chough, W. Hong, C. Caneau, J. Song, J. Hayes
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引用次数: 5
摘要
未掺杂AlInAs的质量是决定AllnAslGaInAs HEMT器件性能的关键因素。近年来,OMCVD生长的未掺杂AIMS的高背景掺杂水平已经成为一个严重的问题,因为它限制了OMCVD生长的AlInAs/GaInAs HEMT的器件性能。最近,与AllnAs相比,G ~, L ~ I ~ P三元材料由于其宽带隙和没有深阱(例如DX中心)而引起了相当大的兴趣[1,2]。此外,通过采用镓钨作为肖特基层,可以通过选择性湿法蚀刻获得非常均匀的掐断电压。然而,报道的具有GaInP肖特基层的LnGaAs HEMT的性能很差。在这项工作中,我们系统地研究了以(AI,Ga~,,)yIn~-yP为肖特基层的AlMs/GaInAs hemt的器件特性。
OMCVD grown AlInAs/GaInAs HEMT's with AlGaInP schottky layer
The quality of undoped AlInAs is a key factor determining device performance of AllnAslGaInAs HEMT's. Recently the high background doping level of undoped AIMS grown by OMCVD has been a serious issue because it limits device performance of OMCVD grown AlInAs/GaInAs HEMT's. Very recently, the G ~ , L ~ I ~ P ternary material has attracted considerable interest as an alternative Schottky layer due to its wide band gap and absence of deep trap (e.g. DX centers) compared with AllnAs [1,2]. Furthermore, by adopting G a W as a Schottky layer, very uniform pinch-off voltage can be achieved using selective wet etching. However, the reported performance of LnGaAs HEMT's with GaInP Schottky layer are very poor. In this work, we have systematically investigated the device characteristics of AlMs/GaInAs HEMTs with (AI,Ga~,,)yIn~-yP as the Schottky layer.