银线键合集成电路在实际应用中的故障

2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Pub Date : 2022-07-18 DOI:10.1109/IPFA55383.2022.9915707

Xuanlong Chen, Xiaping Xie, Min Wang, Yongjia Ruan, Tianhan Liu, Lin Shi

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引用次数: 0

摘要

半导体组装行业已经从金线迁移到铜线，最近开始使用银合金线，因为银合金线具有导电性更高、价格更低和硬度更高的优点。本文综述了实际应用中商用银线键合集成电路的几种失效机制。分析的失效机理主要有:(1)焊盘撞击;(2)电化学迁移;(3)化学腐蚀;(4)导线桥。研究结果对提高银线塑料封装集成电路的可靠性和鲁棒性具有指导意义。

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Failures of Ag Wire Bonding ICs in Real-world Applications

The semiconductor assembly industry has migrated from Au wire to Cu wire, and has recently started with Ag alloy wire, due to the advantages of higher conductivity, lower price and hardness. With this paper, we reviewed several failure mechanisms of commercial silver wire bonding ICs operating in real life applications. The analyzed failure mechanisms are mainly due to: (1) pad cratering, (2) electrochemical migration, (3) chemical corrosion, (4) wire bridge. The results give a guidance on the improvement of the reliability and robustness of plastic encapsulated ICs using Ag wire.

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2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

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