F. Dielacher, M. Tiebout, R. Lachner, H. Knapp, K. Aufinger, W. Sansen
{"title":"用于主动安全系统的SiGe BiCMOS技术和电路","authors":"F. Dielacher, M. Tiebout, R. Lachner, H. Knapp, K. Aufinger, W. Sansen","doi":"10.1109/VLSI-TSA.2014.6839643","DOIUrl":null,"url":null,"abstract":"This paper provides an overview of the features and capabilities of state-of-the-art SiGe devices and BiCMOS technology for applications such as high-data-rate communications and pro-active safety systems like car-radar, identification and e-safety. The capabilities offered by SiGe-BiCMOS and microwave packaging enable the integration of complete transceivers on a chip or in a package even including the antenna. The criteria and trade-off's for the technology selection and system partitioning are described in the introduction. In addition to the electrical components performance, major criteria are addressed such as high reliability, long lifetime and high yield fabrication. Advanced packaging technologies are addressed as well, including embedded passive components and package co-design. Existing circuit design examples and future solutions for 77 GHz automotive radar are presented, followed by a multichannel receiver and a multichannel transmitter for mm-wave people scanners for airport security.","PeriodicalId":403085,"journal":{"name":"Proceedings of Technical Program - 2014 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA)","volume":"465 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2014-04-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"13","resultStr":"{\"title\":\"SiGe BiCMOS technology and circuits for active safety systems\",\"authors\":\"F. Dielacher, M. Tiebout, R. Lachner, H. Knapp, K. Aufinger, W. Sansen\",\"doi\":\"10.1109/VLSI-TSA.2014.6839643\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper provides an overview of the features and capabilities of state-of-the-art SiGe devices and BiCMOS technology for applications such as high-data-rate communications and pro-active safety systems like car-radar, identification and e-safety. The capabilities offered by SiGe-BiCMOS and microwave packaging enable the integration of complete transceivers on a chip or in a package even including the antenna. The criteria and trade-off's for the technology selection and system partitioning are described in the introduction. In addition to the electrical components performance, major criteria are addressed such as high reliability, long lifetime and high yield fabrication. Advanced packaging technologies are addressed as well, including embedded passive components and package co-design. Existing circuit design examples and future solutions for 77 GHz automotive radar are presented, followed by a multichannel receiver and a multichannel transmitter for mm-wave people scanners for airport security.\",\"PeriodicalId\":403085,\"journal\":{\"name\":\"Proceedings of Technical Program - 2014 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA)\",\"volume\":\"465 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2014-04-28\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"13\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of Technical Program - 2014 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/VLSI-TSA.2014.6839643\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of Technical Program - 2014 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/VLSI-TSA.2014.6839643","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
SiGe BiCMOS technology and circuits for active safety systems
This paper provides an overview of the features and capabilities of state-of-the-art SiGe devices and BiCMOS technology for applications such as high-data-rate communications and pro-active safety systems like car-radar, identification and e-safety. The capabilities offered by SiGe-BiCMOS and microwave packaging enable the integration of complete transceivers on a chip or in a package even including the antenna. The criteria and trade-off's for the technology selection and system partitioning are described in the introduction. In addition to the electrical components performance, major criteria are addressed such as high reliability, long lifetime and high yield fabrication. Advanced packaging technologies are addressed as well, including embedded passive components and package co-design. Existing circuit design examples and future solutions for 77 GHz automotive radar are presented, followed by a multichannel receiver and a multichannel transmitter for mm-wave people scanners for airport security.