硅衬底互连宽带传输特性的表征

1993 Proceedings Fifth Annual IEEE International Conference on Wafer Scale Integration Pub Date : 1993-01-20 DOI:10.1109/ICWSI.1993.255251

S. Zaage, E. Groteluschen

{"title":"硅衬底互连宽带传输特性的表征","authors":"S. Zaage, E. Groteluschen","doi":"10.1109/ICWSI.1993.255251","DOIUrl":null,"url":null,"abstract":"Some characteristics of the transmission behavior of interconnections on conductive silicon substrates are presented. With regard to the signal propagation on high-speed digital circuits the broadband behavior of the lines is of special interest. The characteristic impedance and the propagation constant of the lines are determined experimentally by microwave measurements. The influence of the line geometry, the substrate resistivity and the signal frequency on the transmission behavior are clarified. Based on the results of the measurements, the suitability of the conventional RLC line model for time-domain simulations of the transmission characteristics of interconnections on silicon substrates is investigated.<<ETX>>","PeriodicalId":377227,"journal":{"name":"1993 Proceedings Fifth Annual IEEE International Conference on Wafer Scale Integration","volume":"11 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1993-01-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"42","resultStr":"{\"title\":\"Characterization of the broadband transmission behavior of interconnections on silicon substrates\",\"authors\":\"S. Zaage, E. Groteluschen\",\"doi\":\"10.1109/ICWSI.1993.255251\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Some characteristics of the transmission behavior of interconnections on conductive silicon substrates are presented. With regard to the signal propagation on high-speed digital circuits the broadband behavior of the lines is of special interest. The characteristic impedance and the propagation constant of the lines are determined experimentally by microwave measurements. The influence of the line geometry, the substrate resistivity and the signal frequency on the transmission behavior are clarified. Based on the results of the measurements, the suitability of the conventional RLC line model for time-domain simulations of the transmission characteristics of interconnections on silicon substrates is investigated.<<ETX>>\",\"PeriodicalId\":377227,\"journal\":{\"name\":\"1993 Proceedings Fifth Annual IEEE International Conference on Wafer Scale Integration\",\"volume\":\"11 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1993-01-20\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"42\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"1993 Proceedings Fifth Annual IEEE International Conference on Wafer Scale Integration\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICWSI.1993.255251\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"1993 Proceedings Fifth Annual IEEE International Conference on Wafer Scale Integration","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICWSI.1993.255251","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 42

摘要

介绍了导电硅衬底上互连的传输特性。对于信号在高速数字电路中的传播，线路的宽带特性引起了人们的特别关注。通过微波测量实验确定了线路的特性阻抗和传播常数。阐明了线路几何形状、衬底电阻率和信号频率对传输特性的影响。基于测量结果，研究了传统RLC线模型在硅衬底互连传输特性时域模拟中的适用性。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

Characterization of the broadband transmission behavior of interconnections on silicon substrates

Some characteristics of the transmission behavior of interconnections on conductive silicon substrates are presented. With regard to the signal propagation on high-speed digital circuits the broadband behavior of the lines is of special interest. The characteristic impedance and the propagation constant of the lines are determined experimentally by microwave measurements. The influence of the line geometry, the substrate resistivity and the signal frequency on the transmission behavior are clarified. Based on the results of the measurements, the suitability of the conventional RLC line model for time-domain simulations of the transmission characteristics of interconnections on silicon substrates is investigated.<>

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

1993 Proceedings Fifth Annual IEEE International Conference on Wafer Scale Integration

自引率

0.00%

发文量