智能分子束外延系统的成本效益制造化合物半导体外延片

2001 6th International Conference on Solid-State and Integrated Circuit Technology. Proceedings (Cat. No.01EX443) Pub Date : 2001-10-22 DOI:10.1109/ICSICT.2001.981469

H. Lee

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引用次数: 0

摘要

半导体外延过程中的原位非侵入性过程监测和控制已被认为是一种可能改变现有外延晶圆制造方法的使能技术。我们回顾了过去10年来基于传感器的MBE系统的发展，并介绍了在生产环境下运行的基于传感器的MBE系统的最新结果。最后，我们讨论了实现未来智能外延系统的一些技术挑战。

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Intelligent molecular beam epitaxy system for cost-effective manufacturing of compound semiconductor epi-wafers

In situ non-invasive process monitoring and control during semiconductor epitaxy has been recognized as an enabling technology that can potentially transform existing approaches to epi-wafer manufacturing. We review the evolution of sensor-based MBE systems over the past 10 years, and present recent results of a sensor-based MBE system operating under a production environment. Finally, we discuss some technical challenges towards the realization of a futuristic intelligent epitaxy system.

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2001 6th International Conference on Solid-State and Integrated Circuit Technology. Proceedings (Cat. No.01EX443)

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