300℃/spl温度下镍硅化引起的杂质重分布

Yu-Long Jiang, A. Agarwal, G. Ru, X. Qu, Bingzong Li
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引用次数: 4

摘要

采用透射电镜和二次离子质谱技术研究了300℃下镍硅化引起的掺杂物(砷和硼)重分布。在硅化物/硅界面处观察到掺杂物的偏析。在硅化物表面附近还发现了一个高浓度的掺杂峰,认为这是由于Kirkendall空化效应和硅化后体积减小而形成的空穴层。在Ni/sub 2/Si向NiSi转化的过程中,在P+/N Si上形成的硅化物膜的中间区域有一个额外的硼峰。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Dopant redistribution induced by Ni silicidation at 300/spl deg/C
The dopant (arsenic and boron) redistribution induced by Ni silicidation at 300/spl deg/C is investigated by cross-section transmission electron microscopy and secondary ion mass spectroscopy. The dopant segregation at silicide/Si interface is observed. Also a high concentration dopant peak near silicide surface is revealed and attributed to void layer formation due to Kirkendall voiding effect and volume reduction after silicidation. The re-segregation during the conversion from Ni/sub 2/Si to NiSi contributes an extra boron peak in the middle region of the formed silicide film on P+/N Si.
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