T. Takeshita, T. Yamashita, N. Makimoto, T. Kobayashi
{"title":"柔性基板上超薄MEMS反射器件的特性","authors":"T. Takeshita, T. Yamashita, N. Makimoto, T. Kobayashi","doi":"10.1109/OMN.2017.8051489","DOIUrl":null,"url":null,"abstract":"We have developed the ultra-thin MEMS mirror device. The thickness of the mirror device is 5.31 μm including Si structures and actuators. The mirror device was fabricated using SOI wafer on which Pt/SRO/PZT/SRO/Pt/Ti/SiO2 were deposited. The device was bonded on a flexible polyimide substrate and wired using adhesion passed and conductive paste. The mirror device was operated on the bent substrate.","PeriodicalId":411243,"journal":{"name":"2017 International Conference on Optical MEMS and Nanophotonics (OMN)","volume":"19 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2017-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Characteristics of ultra-thin MEMS mirror device on flexibe substrate\",\"authors\":\"T. Takeshita, T. Yamashita, N. Makimoto, T. Kobayashi\",\"doi\":\"10.1109/OMN.2017.8051489\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"We have developed the ultra-thin MEMS mirror device. The thickness of the mirror device is 5.31 μm including Si structures and actuators. The mirror device was fabricated using SOI wafer on which Pt/SRO/PZT/SRO/Pt/Ti/SiO2 were deposited. The device was bonded on a flexible polyimide substrate and wired using adhesion passed and conductive paste. The mirror device was operated on the bent substrate.\",\"PeriodicalId\":411243,\"journal\":{\"name\":\"2017 International Conference on Optical MEMS and Nanophotonics (OMN)\",\"volume\":\"19 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2017-08-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2017 International Conference on Optical MEMS and Nanophotonics (OMN)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/OMN.2017.8051489\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2017 International Conference on Optical MEMS and Nanophotonics (OMN)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/OMN.2017.8051489","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Characteristics of ultra-thin MEMS mirror device on flexibe substrate
We have developed the ultra-thin MEMS mirror device. The thickness of the mirror device is 5.31 μm including Si structures and actuators. The mirror device was fabricated using SOI wafer on which Pt/SRO/PZT/SRO/Pt/Ti/SiO2 were deposited. The device was bonded on a flexible polyimide substrate and wired using adhesion passed and conductive paste. The mirror device was operated on the bent substrate.