柔性基板上超薄MEMS反射器件的特性

T. Takeshita, T. Yamashita, N. Makimoto, T. Kobayashi
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引用次数: 0

摘要

我们开发了超薄MEMS镜像器件。镜面器件的厚度为5.31 μm,包括硅结构和致动器。在SOI晶片上沉积了Pt/SRO/PZT/SRO/Pt/Ti/SiO2。该装置粘接在柔性聚酰亚胺基板上,并使用粘合传递和导电浆料布线。在弯曲的基板上操作镜面装置。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Characteristics of ultra-thin MEMS mirror device on flexibe substrate
We have developed the ultra-thin MEMS mirror device. The thickness of the mirror device is 5.31 μm including Si structures and actuators. The mirror device was fabricated using SOI wafer on which Pt/SRO/PZT/SRO/Pt/Ti/SiO2 were deposited. The device was bonded on a flexible polyimide substrate and wired using adhesion passed and conductive paste. The mirror device was operated on the bent substrate.
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