等离子蚀刻系统的自动预防性维护与Secs协议

P. F. Byrne, D.S. Youlton, K.R. Heiman, A. Miller
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引用次数: 1

摘要

晶圆制造设备需要定期预防性维护(PM),以确保生产环境中的最佳系统性能和正常运行时间。系统停机时间会严重影响半导体制造工厂的利用率和盈利能力。预防性维护是由设备工程师和技术人员在日常例行的基础上进行的手工维护,包括每日pm到年度pm。手动获取PM数据的方法可能因技术人员而异。这会导致不必要的系统停机时间和不准确的数据跟踪。本文研究了一种名为LamPM的新软件包,该软件包通过半导体设备通信标准(SECS-II)协议自动化等离子蚀刻系统的日常pm。泄漏率和质量流量控制器(MFC)数据自动收集和存储,并对数据进行公差限制。然后将故障通知用户。自动化每日PM减少了技术人员的工作时间,同时提供准确和一致的数据。Jntroduction
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Automated Preventive Maintenance Of Plasma Etch Systems With The Secs Protocol
Wafer Fabrication equipment requires scheduled preventive maintenance (PM) to insure the optimum system performance and uptime in production environments. System down time can severely impact the utilization and profitability of a semiconductor manufacturing plant. Preventive maintenance is performed manually on a routine basis ranging from daily PMs to annual PMs by equipment engineers and technicians. The manual acquisition of PM data can vary drastically from one technician to anot.her causing unneeded system down time and inaccurate data tracking. Investigated here is a new software package called LamPM that automates the daily PMs on plasma etch systems through the Semiconductor Equipment Communication Standard (SECS-II) protocol. Leak rates and Mass Flow Controller (MFC) data is automatically collected and stored with tolerance limits applied to the data. The user is then informed of failures. Automating the daily PM reduces technician hours while providing accurate: and consistent data. Jntroduction
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