{"title":"CMOS芯片的生命周期清单","authors":"Stephen P. Boyd, D. Dornfeld, N. Krishnan","doi":"10.1109/ISEE.2006.1650071","DOIUrl":null,"url":null,"abstract":"A life cycle inventory for comparative assessment of assorted semiconductor device types is assembled using a library of process step-related information. In this paper, we present the structure of this library of energy use, material inputs and emissions data at the process equipment-level and facilities-scale, normalized per wafer. Selected results from a case study of a 130nm node CMOS device are presented and compared with a previous study of a comparable chip. Comparative production impacts of 6-layer and 8-layer CMOS devices are shown","PeriodicalId":141255,"journal":{"name":"Proceedings of the 2006 IEEE International Symposium on Electronics and the Environment, 2006.","volume":"43 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2006-05-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"25","resultStr":"{\"title\":\"Life Cycle Inventory of a CMOS Chip\",\"authors\":\"Stephen P. Boyd, D. Dornfeld, N. Krishnan\",\"doi\":\"10.1109/ISEE.2006.1650071\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A life cycle inventory for comparative assessment of assorted semiconductor device types is assembled using a library of process step-related information. In this paper, we present the structure of this library of energy use, material inputs and emissions data at the process equipment-level and facilities-scale, normalized per wafer. Selected results from a case study of a 130nm node CMOS device are presented and compared with a previous study of a comparable chip. Comparative production impacts of 6-layer and 8-layer CMOS devices are shown\",\"PeriodicalId\":141255,\"journal\":{\"name\":\"Proceedings of the 2006 IEEE International Symposium on Electronics and the Environment, 2006.\",\"volume\":\"43 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2006-05-08\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"25\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of the 2006 IEEE International Symposium on Electronics and the Environment, 2006.\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISEE.2006.1650071\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the 2006 IEEE International Symposium on Electronics and the Environment, 2006.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISEE.2006.1650071","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A life cycle inventory for comparative assessment of assorted semiconductor device types is assembled using a library of process step-related information. In this paper, we present the structure of this library of energy use, material inputs and emissions data at the process equipment-level and facilities-scale, normalized per wafer. Selected results from a case study of a 130nm node CMOS device are presented and compared with a previous study of a comparable chip. Comparative production impacts of 6-layer and 8-layer CMOS devices are shown