用于商业无线电应用的新型毫米波MMIC芯片组和模块

1999 IEEE MTT-S International Topical Symposium on Technologies for Wireless Applications (Cat. No. 99TH8390) Pub Date : 1900-01-01 DOI:10.1109/MTTTWA.1999.755133

Y. Ryu, M. Quijije, B. Pinato

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引用次数: 0

摘要

本文介绍了MMIC芯片组和模块的最新发展，以解决毫米波点对点和点对多点无线电。这些mmic和模块专为流行的商业数字无线电频段从18 GHz到43 GHz而设计。商业市场要求低成本和高性能。满足当前和未来需求的最佳方式是专门使用mmic并采用自动化批量生产方法。TRW正在积极解决这些问题，通过设计和制造高性能HEMT和HBT mmic，并通过设计新的封装和组装方法来提高性能并同时降低成本。天合现在提供了一套完整的MMIC芯片来实现高性能的接收模块和大功率的发射模块。

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New millimeter-wave MMIC chip sets and modules for commercial radio application

This paper describes recent developments in MMIC chipsets and modules to address the millimeter-wave point-to-point and point-to-multipoint radios. These MMICs and modules are designed for popular commercial digital radio frequency band from 18 GHz through 43 GHz. Commercial markets demand low cost and high performance. The best way to meet the present and future requirements is to use MMICs exclusively and use automated mass production method. TRW is actively addressing these issues by designing and fabricating high performance HEMT and HBT MMICs and by devising new packaging and assembly methods to enhance the performance and reduce the cost at the same time. TRW is now providing a complete set of MMIC chips to realize high performance receiver modules and high power transmitter modules.

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来源期刊

1999 IEEE MTT-S International Topical Symposium on Technologies for Wireless Applications (Cat. No. 99TH8390)

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