集成电路的大面积自动去处理:现在与未来

EDFA Technical Articles Pub Date : 2019-08-01 DOI:10.31399/asm.edfa.2019-3.p008

E.I. Principe, Z.E. Russell, S. DiDona, M. Therezien, B. Kempshall, K.E. Scammon, J. J. Hagen

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引用次数: 0

摘要

本文讨论了大面积集成电路去处理的现状，自动化去处理设备发展的最新成果，以及气体辅助蚀刻、离子源替代、紧凑光谱和高速激光等技术进步的潜在影响。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Large Area Automated Deprocessing of Integrated Circuits: Present and Future

This article discusses the current state of large area integrated circuit deprocessing, the latest achievements in the development of automated deprocessing equipment, and the potential impact of advancements in gas-assisted etching, ion source alternatives, compact spectroscopy, and high-speed lasers.

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EDFA Technical Articles

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