用于在线信号和数据处理的3D-WASP设备

Proceedings of 1994 International Conference on Wafer Scale Integration (ICWSI) Pub Date : 1994-01-19 DOI:10.1109/ICWSI.1994.291265

S. Hedge, C. Habiger, R. Lea

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引用次数: 5

摘要

虽然混合和单片wsi技术大大提高了嵌入式大规模并行计算机(mpc)的集成密度，但系统和应用工程师仍然需要在更小的空间内获得更大的处理能力。3D-WSI的新兴技术提供了一种应对这一挑战的方法，利用现有的WSI封装选项，提供了阶跃函数并行性增加的潜力。它还允许独立扩展I/O，并行处理能力和控制，从而达到2D-WSI无法比拟的成本效益程度。本文探讨了3D-WASP的潜力，并报告了该设备的工程可行性研究结果

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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3D-WASP devices for on-line signal and data processing

While hybrid and monolithic-WSI technologies have brought about dramatic improvements in the density of integration of embedded massively parallel computers (MPCs), systems and applications engineers continue to demand even more processing power in less space. The emerging technology of 3D-WSI offers a way of meeting this challenge, giving the potential for step-function increases in parallelism using existing WSI package options. It also permits independent scaling of I/O, parallel processing power and control, leading to a degree of cost-effectiveness that 2D-WSI cannot match. The paper explores the potential of 3D-WASP and reports the results of a study into the engineering feasibility of such a device.<>

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Proceedings of 1994 International Conference on Wafer Scale Integration (ICWSI)

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