高温FD-SOI CMOS工艺

L. Demeus, P. Delatte, V. Dessard, S. Adriaensen, A. Viviani, C. Renaux, D. Flandre
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引用次数: 3

摘要

本文介绍了高温电子器件绝缘体上硅(SOI)技术的最新研究成果。我们专注于完全耗尽SOI (FD-SOI)技术,因为与部分耗尽(PD-SOI)技术相比,它具有更好的高温效果。我们的兴趣包括技术考虑和电路研究。我们证明FD-SOI是实现高温应用高性能电路的有效方法。讨论了开发可靠的高温SOI模拟电路的一些基本方面:寿命,参考电压,噪声和基本模拟模块。我们讨论了我们的SOI工艺的一些技术特点,然后重点介绍了侧向双极晶体管(FD-SOI- cmos兼容),这是良好带隙参考所必需的,比较了FD和PD SOI技术的噪声性能,最后介绍了我们与高温电子关键模拟构建模块相关的一些最新结果。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
The art of high temperature FD-SOI CMOS
This paper presents the latest results of our research on SOI (Silicon-On-Insulator) technology for high temperature electronics. We focus on Fully-Depleted SOI (FD-SOI) because it achieves superior high temperature results compared with Partially Depleted (PD-SOI) technology. Our interest includes both technology considerations and circuit studies. We show that FD-SOI is an efficient way to implement high performance circuits for high temperature applications. Some essential aspects for the development of reliable high temperature SOI analog circuits are addressed: lifetime, voltage reference, noise and basic analog building blocks. We discuss some technological characteristics of our SOI process, then focus on lateral bipolar transistors (FD-SOI-CMOS Compatible) which are necessary for good bandgap references, compare noise performance in FD and PD SOI technologies, and finally present some of our latest results relating to critical analog building blocks for high temperature electronics.
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