利用关节计数统计方法对半导体晶圆进行缺陷簇的精确检测和定位

M. Ooi, Y. C. Kang, W. J. Tee, A. A. Mohanan, Chris Chan
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引用次数: 2

摘要

业界普遍观察到,有缺陷的模具往往出现在成组的系统模式中。这些就是所谓的缺陷簇。目前已有许多实现聚类分类和识别的方法,但精度和局限性各不相同。这些方法中的许多虽然功能强大,但通常并不实际检测集群的存在/不存在,而只是对它们进行分段,然后尝试计算分段的有效性。因此,它们隐含地假设缺陷聚类的识别问题是单一的,而实际上缺陷聚类的识别问题可以分为三个不同的阶段:检测、分割和识别。本文提出使用联合计数统计来完成缺陷聚类检测的唯一任务。建议在检测算法完成到满意的水平后再进行分割和识别。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Accurate defect cluster detection and localisation on fabricated semiconductor wafters using joint count statistics
It is widely observed in the industry that defective dies tend to occur in groups of systematic pattern. These are so-called defect clusters. There are many proposed methods to achieve cluster classification and recognition with different degree of accuracy and limitations. Many of these methods, although powerful, generally do not actually detect the presence/absence of a cluster but simply segments them and then attempts to calculate the validity of the segment. Thus, they fail to be flexible and accurate because they implicitly assume that the problem is singular: identify the defect clusters, when in actuality, the problem of defect cluster identification can be divided into three distinct stages: detection, segmentation and recognition. This paper proposes the use of joint-count statistics to perform the sole task of defect cluster detection. It is recommended that segmentation and recognition be performed after the detetion algoritm completed to a satisfactory level.
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