V. Dragoi, T. Glinsner, G. Mittendorfer, M. Wimplinger, P. Lindner
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Reversible wafer bonding for reliable compound semiconductor processing
Reversible wafer bonding is a process enabling reliable compound semiconductor wafer handling for multi-step processes including photolithography, thinning, etching or coating. Two processes using wax and dry film adhesives are presented in this paper.
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