铜导体多层陶瓷电路板

Fourth IEEE/CHMT European International Electronic Manufacturing Technology Symposium Pub Date : 1988-06-13 DOI:10.1109/EEMTS.1988.75942

K. Nobuo, S. Aoki, Y. Imanaka, K. Niwa

{"title":"铜导体多层陶瓷电路板","authors":"K. Nobuo, S. Aoki, Y. Imanaka, K. Niwa","doi":"10.1109/EEMTS.1988.75942","DOIUrl":null,"url":null,"abstract":"The application of copper (Cu) to multilayer ceramic circuit boards fabricated by the green-sheet method is studied. The glass-ceramic composite composed of borosilicate (B/sub 2/O/sub 3/-SiO/sub 2/) glass and alumina (Al/sub 2/O/sub 3/) densifies below the melting point of Cu. The major technical difficulty is to fire the circuit board without Cu oxidation and carbon residue. Carbon intermixes with the glass matrix, lowering the fired density, flexural strength, and breakdown voltage. However, less than 100 p.p.m. of carbon does not influence these properties. A 30-layer ceramic circuit board with a carbon concentration of less than 30 p.p.m. has been fabricated. The signal propagation delay time is 7.3 ns/m. The sheet resistivity of Cu conductors is 1.2 m Omega / Square Operator .<<ETX>>","PeriodicalId":137899,"journal":{"name":"Fourth IEEE/CHMT European International Electronic Manufacturing Technology Symposium","volume":"76 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1988-06-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Multilayer ceramic circuit boards with copper conductors\",\"authors\":\"K. Nobuo, S. Aoki, Y. Imanaka, K. Niwa\",\"doi\":\"10.1109/EEMTS.1988.75942\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The application of copper (Cu) to multilayer ceramic circuit boards fabricated by the green-sheet method is studied. The glass-ceramic composite composed of borosilicate (B/sub 2/O/sub 3/-SiO/sub 2/) glass and alumina (Al/sub 2/O/sub 3/) densifies below the melting point of Cu. The major technical difficulty is to fire the circuit board without Cu oxidation and carbon residue. Carbon intermixes with the glass matrix, lowering the fired density, flexural strength, and breakdown voltage. However, less than 100 p.p.m. of carbon does not influence these properties. A 30-layer ceramic circuit board with a carbon concentration of less than 30 p.p.m. has been fabricated. The signal propagation delay time is 7.3 ns/m. The sheet resistivity of Cu conductors is 1.2 m Omega / Square Operator .<<ETX>>\",\"PeriodicalId\":137899,\"journal\":{\"name\":\"Fourth IEEE/CHMT European International Electronic Manufacturing Technology Symposium\",\"volume\":\"76 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1988-06-13\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Fourth IEEE/CHMT European International Electronic Manufacturing Technology Symposium\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EEMTS.1988.75942\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Fourth IEEE/CHMT European International Electronic Manufacturing Technology Symposium","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EEMTS.1988.75942","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 1

摘要

研究了铜(Cu)在绿片法多层陶瓷电路板中的应用。由硼硅酸盐(B/sub 2/O/sub 3/-SiO/sub 2/)玻璃和氧化铝(Al/sub 2/O/sub 3/)组成的玻璃陶瓷复合材料在Cu熔点以下致密化。主要的技术难点是在烧制电路板时不产生铜氧化和碳渣。碳与玻璃基体混合，降低了烧结密度、弯曲强度和击穿电压。然而，低于100 ppm的碳不会影响这些特性。制备了碳浓度小于30ppm的30层陶瓷电路板。信号传播延迟时间为7.3 ns/m。铜导体的片电阻率为1.2 m ω /平方算子。

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Multilayer ceramic circuit boards with copper conductors

The application of copper (Cu) to multilayer ceramic circuit boards fabricated by the green-sheet method is studied. The glass-ceramic composite composed of borosilicate (B/sub 2/O/sub 3/-SiO/sub 2/) glass and alumina (Al/sub 2/O/sub 3/) densifies below the melting point of Cu. The major technical difficulty is to fire the circuit board without Cu oxidation and carbon residue. Carbon intermixes with the glass matrix, lowering the fired density, flexural strength, and breakdown voltage. However, less than 100 p.p.m. of carbon does not influence these properties. A 30-layer ceramic circuit board with a carbon concentration of less than 30 p.p.m. has been fabricated. The signal propagation delay time is 7.3 ns/m. The sheet resistivity of Cu conductors is 1.2 m Omega / Square Operator .<>

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Fourth IEEE/CHMT European International Electronic Manufacturing Technology Symposium

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