{"title":"通过集成自动化物料处理系统和设备设计，实现300mm半导体制造的设备再利用","authors":"S. Seall, D. Steele, M. Jung","doi":"10.1109/ASMC.2006.1638764","DOIUrl":null,"url":null,"abstract":"This paper describes issues faced by Intel during planning for its first conversion of an existing high volume 200mm semiconductor factory to manufacturing on 300mm wafers. A summary of the constraints and challenges, analysis of alternatives, and description of the adopted solution for modifying AMHS and facility design to allow re-use of an existing 200mm semiconductor fab for manufacturing semiconductors on 300mm wafers is discussed","PeriodicalId":407645,"journal":{"name":"The 17th Annual SEMI/IEEE ASMC 2006 Conference","volume":"87 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2006-05-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Enabling Facility Re-Use for 300mm Semiconductor Manufacturing via Integration of Automated Material Handling System and Facility Design\",\"authors\":\"S. Seall, D. Steele, M. Jung\",\"doi\":\"10.1109/ASMC.2006.1638764\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper describes issues faced by Intel during planning for its first conversion of an existing high volume 200mm semiconductor factory to manufacturing on 300mm wafers. A summary of the constraints and challenges, analysis of alternatives, and description of the adopted solution for modifying AMHS and facility design to allow re-use of an existing 200mm semiconductor fab for manufacturing semiconductors on 300mm wafers is discussed\",\"PeriodicalId\":407645,\"journal\":{\"name\":\"The 17th Annual SEMI/IEEE ASMC 2006 Conference\",\"volume\":\"87 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2006-05-22\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"The 17th Annual SEMI/IEEE ASMC 2006 Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ASMC.2006.1638764\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"The 17th Annual SEMI/IEEE ASMC 2006 Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ASMC.2006.1638764","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Enabling Facility Re-Use for 300mm Semiconductor Manufacturing via Integration of Automated Material Handling System and Facility Design
This paper describes issues faced by Intel during planning for its first conversion of an existing high volume 200mm semiconductor factory to manufacturing on 300mm wafers. A summary of the constraints and challenges, analysis of alternatives, and description of the adopted solution for modifying AMHS and facility design to allow re-use of an existing 200mm semiconductor fab for manufacturing semiconductors on 300mm wafers is discussed
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