薄膜光子集成的对接内置(BJB)结构

D. Inoue, Jieun Lee, T. Shindo, M. Futami, K. Doi, T. Amemiya, N. Nishiyama, S. Arai
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引用次数: 6

摘要

片上光互连有可能取代LSI芯片上的全球铜线。在本工作中,作为一种集成方法,对175 nm厚GaInAsP/InP进行了OMVPE对接再生,实现了主动和被动组分的集成。在数值计算中,估计设计的对接联轴器的耦合效率和剩余反射分别为98%和-40 dB。在实验方法中,我们研究了对接界面形貌和再生表面平整度对侧蚀深度和台面角的依赖关系。结果,获得了一个平坦的再生表面,而结晶质量没有下降。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Butt-joint built-in (BJB) structure for membrane photonic integration
On-chip optical interconnections have potential for replace global copper wires on LSI chips. I n this work, as an integration method, an OMVPE butt-joint regrowth of 175-nm thick GaInAsP/InP was conducted toward an integration of active and passive components. In the numerical calculation, a coupling efficiency and residual reflection of designed butt-joint coupling were estimated to be 98% and -40 dB, respectively. In the experimental method, we investigated the dependence of butt-joint interface morphology and regrown surface flatness on the side etch depth and the mesa angle. As a result, a flat regrown surface without degradation in crystalline quality was obtained.
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