M. Cantoro, C. Merckling, S. Jiang, W. Guo, N. Waldron, H. Bender, A. Moussa, B. Douhard, W. Vandervorst, M. Heyns, J. Dekoster, R. Loo, M. Caymax
{"title":"III-V型化合物半导体在硅上的单片集成:高宽高比结构的选择性面积生长与应变松弛缓冲介导外延","authors":"M. Cantoro, C. Merckling, S. Jiang, W. Guo, N. Waldron, H. Bender, A. Moussa, B. Douhard, W. Vandervorst, M. Heyns, J. Dekoster, R. Loo, M. Caymax","doi":"10.1109/CSICS.2012.6340064","DOIUrl":null,"url":null,"abstract":"We report two approaches to integrate high quality III-V templates by epitaxial growth with low defectivity on Si wafers. The first approach is based on blanket, InGaAs-based Strain Relaxed Buffers grown by MOVPE on 200mm Si, and the second on the selective area MOVPE of InP in Shallow Trench Isolation structures patterned on 300mm Si. Both structures are characterized structurally and show the efficient trapping and annihilation of defects propagation from the Si/III-V interface. We believe these two approaches represent viable alternatives towards the realization of CMOS-compatible III-V templates and stacks for high-performance devices monolithically integrated on Si.","PeriodicalId":290079,"journal":{"name":"2012 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS)","volume":"23 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2012-10-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":"{\"title\":\"Towards the Monolithic Integration of III-V Compound Semiconductors on Si: Selective Area Growth in High Aspect Ratio Structures vs. Strain Relaxed Buffer-Mediated Epitaxy\",\"authors\":\"M. Cantoro, C. Merckling, S. Jiang, W. Guo, N. Waldron, H. Bender, A. Moussa, B. Douhard, W. Vandervorst, M. Heyns, J. Dekoster, R. Loo, M. Caymax\",\"doi\":\"10.1109/CSICS.2012.6340064\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"We report two approaches to integrate high quality III-V templates by epitaxial growth with low defectivity on Si wafers. The first approach is based on blanket, InGaAs-based Strain Relaxed Buffers grown by MOVPE on 200mm Si, and the second on the selective area MOVPE of InP in Shallow Trench Isolation structures patterned on 300mm Si. Both structures are characterized structurally and show the efficient trapping and annihilation of defects propagation from the Si/III-V interface. We believe these two approaches represent viable alternatives towards the realization of CMOS-compatible III-V templates and stacks for high-performance devices monolithically integrated on Si.\",\"PeriodicalId\":290079,\"journal\":{\"name\":\"2012 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS)\",\"volume\":\"23 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2012-10-25\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"6\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2012 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/CSICS.2012.6340064\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2012 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/CSICS.2012.6340064","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Towards the Monolithic Integration of III-V Compound Semiconductors on Si: Selective Area Growth in High Aspect Ratio Structures vs. Strain Relaxed Buffer-Mediated Epitaxy
We report two approaches to integrate high quality III-V templates by epitaxial growth with low defectivity on Si wafers. The first approach is based on blanket, InGaAs-based Strain Relaxed Buffers grown by MOVPE on 200mm Si, and the second on the selective area MOVPE of InP in Shallow Trench Isolation structures patterned on 300mm Si. Both structures are characterized structurally and show the efficient trapping and annihilation of defects propagation from the Si/III-V interface. We believe these two approaches represent viable alternatives towards the realization of CMOS-compatible III-V templates and stacks for high-performance devices monolithically integrated on Si.