III-V型化合物半导体在硅上的单片集成:高宽高比结构的选择性面积生长与应变松弛缓冲介导外延

M. Cantoro, C. Merckling, S. Jiang, W. Guo, N. Waldron, H. Bender, A. Moussa, B. Douhard, W. Vandervorst, M. Heyns, J. Dekoster, R. Loo, M. Caymax
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引用次数: 6

摘要

我们报告了两种通过低缺陷外延生长在硅片上集成高质量III-V模板的方法。第一种方法是在200mm Si上通过MOVPE生长的基于ingaas的应变松弛缓冲层,第二种方法是在300mm Si上的浅沟隔离结构中InP的选择性区域MOVPE。这两种结构都具有结构特征,并表现出从Si/III-V界面传播的缺陷的有效捕获和湮灭。我们相信这两种方法代表了实现cmos兼容III-V模板和堆栈的可行选择,用于高性能器件单片集成在Si上。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Towards the Monolithic Integration of III-V Compound Semiconductors on Si: Selective Area Growth in High Aspect Ratio Structures vs. Strain Relaxed Buffer-Mediated Epitaxy
We report two approaches to integrate high quality III-V templates by epitaxial growth with low defectivity on Si wafers. The first approach is based on blanket, InGaAs-based Strain Relaxed Buffers grown by MOVPE on 200mm Si, and the second on the selective area MOVPE of InP in Shallow Trench Isolation structures patterned on 300mm Si. Both structures are characterized structurally and show the efficient trapping and annihilation of defects propagation from the Si/III-V interface. We believe these two approaches represent viable alternatives towards the realization of CMOS-compatible III-V templates and stacks for high-performance devices monolithically integrated on Si.
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