Re-wafer scale integration: a new approach to active phased arrays

Describes a new approach to active phased array technology. Here, several modules are fabricated at the same time and placed in a layered structure. The layers include the RF modules, cooling manifold, DC bias distribution, RF manifold, and radiating elements. In this configuration, 16 or more T/R modules are fabricated on a single 3-inch GaAs wafer. The realization of multiple modules on a wafer is made possible by redundancy of circuit elements and novel mechanical switches. Preliminary results on these efforts are presented.<>