{"title":"面向未来系统的高完整性多核建模(HI-MCM)","authors":"","doi":"10.1109/fdl.2015.7306357","DOIUrl":null,"url":null,"abstract":"Modern embedded applications already integrate a multitude of functionalities with potentially different criticality levels into a single system. Driven by the availability of embedded multi-core System-on-Chips, this trend is expected to grow in the near future. Without appropriate preconditions, the integration of mixed-criticality subsystems can lead to a significant and potentially unacceptable increase of engineering and certification costs.","PeriodicalId":171448,"journal":{"name":"2015 Forum on Specification and Design Languages (FDL)","volume":"103 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"High integrity multi-core modelling for future systems (HI-MCM)\",\"authors\":\"\",\"doi\":\"10.1109/fdl.2015.7306357\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Modern embedded applications already integrate a multitude of functionalities with potentially different criticality levels into a single system. Driven by the availability of embedded multi-core System-on-Chips, this trend is expected to grow in the near future. Without appropriate preconditions, the integration of mixed-criticality subsystems can lead to a significant and potentially unacceptable increase of engineering and certification costs.\",\"PeriodicalId\":171448,\"journal\":{\"name\":\"2015 Forum on Specification and Design Languages (FDL)\",\"volume\":\"103 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1900-01-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2015 Forum on Specification and Design Languages (FDL)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/fdl.2015.7306357\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2015 Forum on Specification and Design Languages (FDL)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/fdl.2015.7306357","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
High integrity multi-core modelling for future systems (HI-MCM)
Modern embedded applications already integrate a multitude of functionalities with potentially different criticality levels into a single system. Driven by the availability of embedded multi-core System-on-Chips, this trend is expected to grow in the near future. Without appropriate preconditions, the integration of mixed-criticality subsystems can lead to a significant and potentially unacceptable increase of engineering and certification costs.
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