{"title":"在铝电极上覆盖镍/金后，将单壁碳纳米管与CMOS IC集成","authors":"Jung-Tang Huang, Kai-Yuan Jenq, Po-Chin Lin, Hou-Jun Hsu, T. Tsai, Ching-Kong Chen","doi":"10.1109/IITC.2009.5090378","DOIUrl":null,"url":null,"abstract":"This paper presents the interconnection of single -walled carbon nanotube (SWNT) between electrodes on a CMOS integrated circuit chip made by TSMC 0.35µm CMOS process. Alternating current dielectrophoretic force (AC-DEP) method is employed to micro-electrode that makes SWNTs deposited between electrodes. Using Electroless Nickel and Immersion Gold to cover the electrodes of Al could really increase the current more than 3 orders when SWNTs are connected between electrodes.","PeriodicalId":301012,"journal":{"name":"2009 IEEE International Interconnect Technology Conference","volume":"33 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2009-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"The integration of SWNTs with CMOS IC after covering Nickel/Gold on the Aluminum electrodes\",\"authors\":\"Jung-Tang Huang, Kai-Yuan Jenq, Po-Chin Lin, Hou-Jun Hsu, T. Tsai, Ching-Kong Chen\",\"doi\":\"10.1109/IITC.2009.5090378\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents the interconnection of single -walled carbon nanotube (SWNT) between electrodes on a CMOS integrated circuit chip made by TSMC 0.35µm CMOS process. Alternating current dielectrophoretic force (AC-DEP) method is employed to micro-electrode that makes SWNTs deposited between electrodes. Using Electroless Nickel and Immersion Gold to cover the electrodes of Al could really increase the current more than 3 orders when SWNTs are connected between electrodes.\",\"PeriodicalId\":301012,\"journal\":{\"name\":\"2009 IEEE International Interconnect Technology Conference\",\"volume\":\"33 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2009-06-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2009 IEEE International Interconnect Technology Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IITC.2009.5090378\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2009 IEEE International Interconnect Technology Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IITC.2009.5090378","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
The integration of SWNTs with CMOS IC after covering Nickel/Gold on the Aluminum electrodes
This paper presents the interconnection of single -walled carbon nanotube (SWNT) between electrodes on a CMOS integrated circuit chip made by TSMC 0.35µm CMOS process. Alternating current dielectrophoretic force (AC-DEP) method is employed to micro-electrode that makes SWNTs deposited between electrodes. Using Electroless Nickel and Immersion Gold to cover the electrodes of Al could really increase the current more than 3 orders when SWNTs are connected between electrodes.
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