集成电路中的热耦合现象:基于热耦合的电路分析与综合模型

ESSCIRC 76: 2nd European Solid State Circuits Conference Pub Date : 1976-09-01 DOI:10.1109/ESSCIRC.1976.5469097

V. Székely, K. Tarnay

{"title":"集成电路中的热耦合现象:基于热耦合的电路分析与综合模型","authors":"V. Székely, K. Tarnay","doi":"10.1109/ESSCIRC.1976.5469097","DOIUrl":null,"url":null,"abstract":"The lecture presents a modeling method for the combined electric-thermal effects of monolithic IC's. The method is compatible to the usual computer simulation techniques of electronic circuits. Typical application areas are: analysis of low frequency response of operational amplifiers, design of circuits with temperature-stabilized substrate, thermal functional circuits, etc.","PeriodicalId":378614,"journal":{"name":"ESSCIRC 76: 2nd European Solid State Circuits Conference","volume":"25 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1976-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Thermal Coupling Phenomena in IC's: Models for Analysis and Synthesis for Circuits based on Thermal Coupling\",\"authors\":\"V. Székely, K. Tarnay\",\"doi\":\"10.1109/ESSCIRC.1976.5469097\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The lecture presents a modeling method for the combined electric-thermal effects of monolithic IC's. The method is compatible to the usual computer simulation techniques of electronic circuits. Typical application areas are: analysis of low frequency response of operational amplifiers, design of circuits with temperature-stabilized substrate, thermal functional circuits, etc.\",\"PeriodicalId\":378614,\"journal\":{\"name\":\"ESSCIRC 76: 2nd European Solid State Circuits Conference\",\"volume\":\"25 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1976-09-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"ESSCIRC 76: 2nd European Solid State Circuits Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ESSCIRC.1976.5469097\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"ESSCIRC 76: 2nd European Solid State Circuits Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ESSCIRC.1976.5469097","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 0

摘要

本讲座介绍了单片集成电路的电热效应的建模方法。该方法与一般的电子电路计算机仿真技术兼容。典型的应用领域有:运算放大器低频响应分析、温度稳定衬底电路设计、热功能电路等。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

Thermal Coupling Phenomena in IC's: Models for Analysis and Synthesis for Circuits based on Thermal Coupling

The lecture presents a modeling method for the combined electric-thermal effects of monolithic IC's. The method is compatible to the usual computer simulation techniques of electronic circuits. Typical application areas are: analysis of low frequency response of operational amplifiers, design of circuits with temperature-stabilized substrate, thermal functional circuits, etc.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

ESSCIRC 76: 2nd European Solid State Circuits Conference

自引率

0.00%

发文量