{"title":"300mm晶圆AMHS处理冲击与振动规范的开发","authors":"J. Steele, T. Biswas","doi":"10.1109/ASMC.2006.1638762","DOIUrl":null,"url":null,"abstract":"In this work, a technique is presented for establishing and verifying safe vibration and shock limits for preventing cross-slotting of 300mm wafers in FOUPs during AMHS handling. This technique includes establishing the safe limits using a shaker table, calibrating these limits for a particular portable accelerometer, and then using this portable accelerometer to check an AMHS for compliance to these limits","PeriodicalId":407645,"journal":{"name":"The 17th Annual SEMI/IEEE ASMC 2006 Conference","volume":"28 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2006-05-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"Development of a Shock & Vibration Spec for 300mm Wafer AMHS Handling\",\"authors\":\"J. Steele, T. Biswas\",\"doi\":\"10.1109/ASMC.2006.1638762\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this work, a technique is presented for establishing and verifying safe vibration and shock limits for preventing cross-slotting of 300mm wafers in FOUPs during AMHS handling. This technique includes establishing the safe limits using a shaker table, calibrating these limits for a particular portable accelerometer, and then using this portable accelerometer to check an AMHS for compliance to these limits\",\"PeriodicalId\":407645,\"journal\":{\"name\":\"The 17th Annual SEMI/IEEE ASMC 2006 Conference\",\"volume\":\"28 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2006-05-22\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"The 17th Annual SEMI/IEEE ASMC 2006 Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ASMC.2006.1638762\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"The 17th Annual SEMI/IEEE ASMC 2006 Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ASMC.2006.1638762","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Development of a Shock & Vibration Spec for 300mm Wafer AMHS Handling
In this work, a technique is presented for establishing and verifying safe vibration and shock limits for preventing cross-slotting of 300mm wafers in FOUPs during AMHS handling. This technique includes establishing the safe limits using a shaker table, calibrating these limits for a particular portable accelerometer, and then using this portable accelerometer to check an AMHS for compliance to these limits