面向MCMS的可编程CMOS衬底互连研究

Proceedings. International Semiconductor Conference Pub Date : 2002-12-16 DOI:10.1109/SMICND.2002.1105857

M. Fraile, R. Martínez, L. Terés

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引用次数: 0

摘要

多芯片模块(MCM)制造技术为减小电子系统的尺寸、提高其功耗和速度提供了一种新的方法。为了利用这一点并最大限度地降低成本，我们应该找到在不同应用中重复使用基板的方法。我们已经恢复了第一辆测试车的实施，并介绍了第二辆原型车(FPS-2M)的开发，特性和测试以及其他一些设备和测试环境。

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Toward an interconnect programmable CMOS substrate for MCMS

Multi-Chip Module (MCM) manufacturing technologies offers a new approach for reducing the size of electronics systems and improving its power consumption and speed. In order to take advantage of this and minimise cost, we should find ways of reusing a substrate in different applications. We have resumed the implementation of first test vehicle and it is presented the developed, characterisation and test of a second prototype (FPS-2M) and some other devices and the environment for test.

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Proceedings. International Semiconductor Conference

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