高静水压力下奇克拉尔斯基生长硅中热给体形成的特性

V. V. Emtsev, V. Emtsev, G. Oganesyan, A. Misiuk, C. A. Londos
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引用次数: 2

摘要

研究了在T = 450℃、常压和高静水压力P = 1条件下对直拉生长硅进行热处理后氧团聚形成热供体的过程。所研究的样品中掺杂了碳和锗等电子杂质。已知这两种杂质在正常热处理条件下抑制热供体的形成过程。研究表明,对含有高浓度这些杂质的Cz-Si进行热处理时施加的应力会导致热供体的形成增强。这种效应被认为与压力下氧气扩散率的增加有关。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Peculiarities of the thermal donor formation in Czochralski-grown silicon under high hydrostatic pressure
Oxygen agglomeration processes leading to the formation of thermal donors in Czochralski grown silicon subjected to heat treatment at T equals 450 degrees C at atmospheric pressure and a high hydrostatic pressure of P equals 1 are studied. The samples investigated were doped with isoelectronic impurities of carbon and germanium. Both impurities are known to suppress the formation processes of thermal donors under normal conditions of heat treatment. It has been shown that the stress applied during heat treatment to Cz-Si with high concentrations of these impurities results in an enhanced formation of thermal donors. This effect is thought to be associated with increasing oxygen diffusivity under stress.
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