短栅和独立栅7nm FinFET标准电池的布局表征和功率密度分析

Tiansong Cui, Bowen Chen, Yanzhi Wang, Shahin Nazarian, Massoud Pedram
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引用次数: 5

摘要

本文提出了一种基于短栅(SG)和独立栅(IG)标准电池的7nm FinFET技术节点的功率密度分析。通过为每个逻辑单元的上拉和下拉网络选择适当数量的鳍来建立liberty格式的标准单元库。然后,根据基于lambda的FinFET器件布局设计规则,对短栅和独立栅标准单元的布局进行了表征。最后,分析了7nm FinFET技术节点与45 nm CMOS技术节点在不同电路中的功率密度。实验结果表明,在间隔定义技术下,每个7nm FinFET电路的功率密度比45nm CMOS电路大3-20倍。实验结果还表明,后门信号可以更好地控制独立栅极finfet的功耗。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Layout Characterization and Power Density Analysis for Shorted-Gate and Independent-Gate 7nm FinFET Standard Cells
In this paper, a power density analysis is presented for 7nm FinFET technology node based on both shorted-gate (SG) and independent-gate (IG) standard cells operating in multiple supply voltage regimes. A Liberty-formatted standard cell library is established by selecting the appropriate number of fins for the pull-up and pull-down networks of each logic cell. The layout of both shorted-gate and independent-gate standard cells are then characterized according to lambda-based layout design rules for FinFET devices. Finally, the power density of 7nm FinFET technology node is analyzed and compared with the 45 nm CMOS technology node for different circuits. Experimental result shows that the power density of each 7nm FinFET circuit is 3-20 times larger than that of 45nm CMOS circuit under the spacer-defined technology. Experimental result also shows that the back-gate signal enables a better control of power consumption for independent-gate FinFETs.
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