用于100ghz以上集成电路的全系列直流隔离的紧凑型宽带差分互连

M. Abdolhamidi, M. Mohammad‐Taheri
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引用次数: 3

摘要

提出了一种用于差分TEM传输线(如宽频耦合带状线)的具有完全直流隔离特性的宽带互连(包括信号路径和地路径)。在100 ~ 500 GHz频段的中心频率处,该结构的总长度仅为0.1λg。模拟的互连在130 ~ 280 GHz频段(约0.7倍频程)的输入和输出端口显示出超过20 dB的回波损耗。此外,在整个100 ~ 500 GHz频段的模拟中,回波损耗超过15dB。信号和地路径的内置直流隔离特性,使所提出的互连成为集成有源电路信号-地交换应用的合适解决方案,如微带到反微带转换。所提出的设计程序适用于各种标准的集成电路制造工艺。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A compact wideband differential interconnect for complete series DC-isolation of integrated circuits above 100 GHz
A wideband interconnect with complete DC-isolation property (both in the Signal and Ground paths) for differential TEM transmission lines (like broadside-coupled striplines) is presented. The overall length of the proposed structure is only 0.1λg at the center frequency of 100 ∼ 500 GHz frequency band. The simulated interconnect shows more than 20 dB of return losses at the input and output ports in 130 ∼ 280 GHz band (about 0.7 octave). In addition, more than 15dB of return losses is achieved in the simulations in the entire 100 ∼ 500 GHz frequency band. The built-in DC-isolation property of both the Signal and Ground paths, makes the presented interconnect a suitable solution for Signal-Ground swapping applications of integrated active circuits, like that of the microstrip to inverted-microstrip transitions. The presented design procedure is applicable to various standard IC fabrication processes.
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