{"title":"用于100ghz以上集成电路的全系列直流隔离的紧凑型宽带差分互连","authors":"M. Abdolhamidi, M. Mohammad‐Taheri","doi":"10.1109/APMC.2016.7931270","DOIUrl":null,"url":null,"abstract":"A wideband interconnect with complete DC-isolation property (both in the Signal and Ground paths) for differential TEM transmission lines (like broadside-coupled striplines) is presented. The overall length of the proposed structure is only 0.1λg at the center frequency of 100 ∼ 500 GHz frequency band. The simulated interconnect shows more than 20 dB of return losses at the input and output ports in 130 ∼ 280 GHz band (about 0.7 octave). In addition, more than 15dB of return losses is achieved in the simulations in the entire 100 ∼ 500 GHz frequency band. The built-in DC-isolation property of both the Signal and Ground paths, makes the presented interconnect a suitable solution for Signal-Ground swapping applications of integrated active circuits, like that of the microstrip to inverted-microstrip transitions. The presented design procedure is applicable to various standard IC fabrication processes.","PeriodicalId":166478,"journal":{"name":"2016 Asia-Pacific Microwave Conference (APMC)","volume":"29 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2016-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"A compact wideband differential interconnect for complete series DC-isolation of integrated circuits above 100 GHz\",\"authors\":\"M. Abdolhamidi, M. Mohammad‐Taheri\",\"doi\":\"10.1109/APMC.2016.7931270\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A wideband interconnect with complete DC-isolation property (both in the Signal and Ground paths) for differential TEM transmission lines (like broadside-coupled striplines) is presented. The overall length of the proposed structure is only 0.1λg at the center frequency of 100 ∼ 500 GHz frequency band. The simulated interconnect shows more than 20 dB of return losses at the input and output ports in 130 ∼ 280 GHz band (about 0.7 octave). In addition, more than 15dB of return losses is achieved in the simulations in the entire 100 ∼ 500 GHz frequency band. The built-in DC-isolation property of both the Signal and Ground paths, makes the presented interconnect a suitable solution for Signal-Ground swapping applications of integrated active circuits, like that of the microstrip to inverted-microstrip transitions. The presented design procedure is applicable to various standard IC fabrication processes.\",\"PeriodicalId\":166478,\"journal\":{\"name\":\"2016 Asia-Pacific Microwave Conference (APMC)\",\"volume\":\"29 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2016-12-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2016 Asia-Pacific Microwave Conference (APMC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/APMC.2016.7931270\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 Asia-Pacific Microwave Conference (APMC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/APMC.2016.7931270","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A compact wideband differential interconnect for complete series DC-isolation of integrated circuits above 100 GHz
A wideband interconnect with complete DC-isolation property (both in the Signal and Ground paths) for differential TEM transmission lines (like broadside-coupled striplines) is presented. The overall length of the proposed structure is only 0.1λg at the center frequency of 100 ∼ 500 GHz frequency band. The simulated interconnect shows more than 20 dB of return losses at the input and output ports in 130 ∼ 280 GHz band (about 0.7 octave). In addition, more than 15dB of return losses is achieved in the simulations in the entire 100 ∼ 500 GHz frequency band. The built-in DC-isolation property of both the Signal and Ground paths, makes the presented interconnect a suitable solution for Signal-Ground swapping applications of integrated active circuits, like that of the microstrip to inverted-microstrip transitions. The presented design procedure is applicable to various standard IC fabrication processes.