RD53A: HL-LHC硅像素探测器二期升级的大型样机

E. Monteil, M. Barbero, D. Fougeron, S. Godiot, M. Menouni, P. Pangaud, A. Rozanov, P. Breugnon, M. Bomben, G. Calderini, F. Crescioli, G. Marchiori, D. Dzahini, F. Rarbi, R. Gaglione, H. Krueger, T. Hemperek, F. Huegging, P. Rymazewski, M. Vogt, T. Wang, N. Wermes, M. Karagounis, C. Marzocca, F. Loddo, F. Licciulli, A. Andreazza, V. Liberali, A. Stabile, L. Frontini, M. Bagatin, D. Bisello, S. Gerardin, S. Mattiazzo, A. Paccagnella, D. Vogrig, S. Bonaldo, N. Bacchetta, L. Gaioni, M. Manghisoni, V. Re, E. Riceputi, G. Traversi, L. Ratti, C. Vacchi, K. Androsov, R. Beccherle, G. Magazzú, M. Minuti, F. Morsani, F. Palla, S. Poulios, G. Bilei, M. Menichelli, P. Placidi, S. Marconi, G. Dellacasa, N. Demaria, G. Mazza, E. Monteil, L. Pacher, A. Rivetti, A. Paternò, D. Gajanna, V. Gromov, R. Kluit, A. Vitkovskiy, T. Benka, M. Havranek, Z. Janoška, M. Marcisovsky, G. Neue, L. Tomasek, V. Kafka, V. Vrba, E. López-Morillo, F. R. Palomo, F. Muñoz, I. Vila, E. Jiménez, D. Abbaneo, J. Christiansen, S. Orfanelli, S. B
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引用次数: 4

摘要

HL-LHC实验硅像素探测器的第二阶段升级具有极端要求,例如:50x50 μm像素,高速率(3 GHz/cm2),前所未有的辐射水平(1 Grad),高读出速度和串行供电。因此,需要一个新的读出芯片。在这个框架中,RD53合作提交了RD53A,一个采用65纳米CMOS技术设计的大规模芯片演示器,集成了400×192像素矩阵。它以模拟和数字像素矩阵的设计变化为特征,用于测试目的。构建模块的概述将与单芯片上的测试结果一起给出。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
RD53A: a large scale prototype for HL-LHC silicon pixel detector phase 2 upgrades
The Phase 2 upgrades of silicon pixel detectors at HL-LHC experiments feature extreme require- ments, such as: 50x50 μm pixels, high rate (3 GHz/cm2), unprecedented radiation levels (1 Grad), high readout speed and serial powering. As a consequence a new readout chip is required. In this framework the RD53 collaboration submitted RD53A, a large scale chip demonstrator de- signed in 65 nm CMOS technology, integrating a matrix of 400×192 pixels. It features design variations in the analog and digital pixel matrix for testing purposes. An overview of the building blocks will be given together with test results on single chips.
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