{"title":"确定接触阻抗为主要电磁硬度退化因素的案例","authors":"L. Hoeft","doi":"10.1109/ISEMC.1986.7568277","DOIUrl":null,"url":null,"abstract":"An examination of a wide range of experimental data shows that contact impedance rather than enlargement of apertures or changes in material con ductivity is the major electromagnetic hardness degradation factor. It is also the least understood.","PeriodicalId":244612,"journal":{"name":"1986 IEEE International Symposium on Electromagnetic Compatibility","volume":"35 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1986-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"The Case for Identifying Contact Impedance as the Major Electromagnetic Hardness Degradation Factor\",\"authors\":\"L. Hoeft\",\"doi\":\"10.1109/ISEMC.1986.7568277\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"An examination of a wide range of experimental data shows that contact impedance rather than enlargement of apertures or changes in material con ductivity is the major electromagnetic hardness degradation factor. It is also the least understood.\",\"PeriodicalId\":244612,\"journal\":{\"name\":\"1986 IEEE International Symposium on Electromagnetic Compatibility\",\"volume\":\"35 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1986-09-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"1986 IEEE International Symposium on Electromagnetic Compatibility\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISEMC.1986.7568277\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"1986 IEEE International Symposium on Electromagnetic Compatibility","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISEMC.1986.7568277","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
The Case for Identifying Contact Impedance as the Major Electromagnetic Hardness Degradation Factor
An examination of a wide range of experimental data shows that contact impedance rather than enlargement of apertures or changes in material con ductivity is the major electromagnetic hardness degradation factor. It is also the least understood.
求助内容：
应助结果提醒方式：
京公网安备 11010802042870号
