Dong Wang, Sho Kamezawa, K. Yamamoto, H. Nakashima
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引用次数: 0
摘要
锗(Ge)具有0.8 eV的直接带隙,与光通信的波长相匹配,是一种很有前途的片上光电器件材料。直接带隙和间接带隙之间的能量差仅为134 meV,这意味着直接带隙发光的可能性。一般来说,锗光发射极采用p-i-n二极管结构,其制作工艺相对复杂,高质量的n型掺杂仍然是一个问题。最近我们实现了电子ΦBN = 0.60 eV (HfGe/n-Ge)和空穴ΦBP = 0.57 eV (TiN/p-Ge)的高肖特基势垒高度[1,2]。基于该技术,我们利用翅片型不对称金属/锗/金属(HfGe/Ge/TiN)结构,演示了块状锗的直接带隙室温电致发光(EL)。
Direct band gap electroluminescence from bulk germanium at room temperature using an asymmetric metal/germanium/metal structure
As a promising material for fabricating on-chip optoelectronic devices, germanium (Ge) has a direct band gap of 0.8 eV, which matches with the wavelength for optical communication. The energy difference is only 134 meV between direct and indirect band gaps, implying the possibility of a direct band gap light emission. In general, a p-i-n diode structure is used for a Ge photo emitter, of which fabrication process is relatively complicated and high-quality n-type doping is still an issue. Recently we achieved high Schottky barrier heights for electrons ΦBN = 0.60 eV (HfGe/n-Ge) and holes ΦBP = 0.57 eV (TiN/p-Ge) [1,2]. Based on this technology, we demonstrate direct band gap room temperature electroluminescence (EL) from bulk Ge using a fin-type asymmetric metel/Ge/metal (HfGe/Ge/TiN) structure.