采用SiCer技术制造高强度差压传感器

2022 International Conference on Electronics Packaging (ICEP) Pub Date : 2022-05-11 DOI:10.23919/ICEP55381.2022.9795558

C. Kleinholz, A. Cyriax, M. Hintz, J. Müller, T. Ortlepp

{"title":"采用SiCer技术制造高强度差压传感器","authors":"C. Kleinholz, A. Cyriax, M. Hintz, J. Müller, T. Ortlepp","doi":"10.23919/ICEP55381.2022.9795558","DOIUrl":null,"url":null,"abstract":"Commonly pressure sensors are often fabricated using silicon direct bonding or anodic bonding processes. Because of that additional preparation steps must be carried out and the achieved results of a high-strength bonding interface is not always sufficient. For this reason, the SiCer technology is a great advantage due to the combination of silicon and ceramics in a common sintering process and impress with good compatibility and high bonding strength.","PeriodicalId":413776,"journal":{"name":"2022 International Conference on Electronics Packaging (ICEP)","volume":"16 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Manufacture of high-strength differential pressure sensor using SiCer technology\",\"authors\":\"C. Kleinholz, A. Cyriax, M. Hintz, J. Müller, T. Ortlepp\",\"doi\":\"10.23919/ICEP55381.2022.9795558\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Commonly pressure sensors are often fabricated using silicon direct bonding or anodic bonding processes. Because of that additional preparation steps must be carried out and the achieved results of a high-strength bonding interface is not always sufficient. For this reason, the SiCer technology is a great advantage due to the combination of silicon and ceramics in a common sintering process and impress with good compatibility and high bonding strength.\",\"PeriodicalId\":413776,\"journal\":{\"name\":\"2022 International Conference on Electronics Packaging (ICEP)\",\"volume\":\"16 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2022-05-11\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2022 International Conference on Electronics Packaging (ICEP)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.23919/ICEP55381.2022.9795558\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 International Conference on Electronics Packaging (ICEP)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/ICEP55381.2022.9795558","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 0

摘要

通常，压力传感器通常采用硅直接键合或阳极键合工艺制造。因此，必须进行额外的制备步骤，并且获得的高强度粘合界面并不总是足够的。因此，SiCer技术具有很大的优势，因为硅和陶瓷在普通烧结工艺中结合，并且具有良好的相容性和高结合强度。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

Manufacture of high-strength differential pressure sensor using SiCer technology

Commonly pressure sensors are often fabricated using silicon direct bonding or anodic bonding processes. Because of that additional preparation steps must be carried out and the achieved results of a high-strength bonding interface is not always sufficient. For this reason, the SiCer technology is a great advantage due to the combination of silicon and ceramics in a common sintering process and impress with good compatibility and high bonding strength.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

2022 International Conference on Electronics Packaging (ICEP)

自引率

0.00%

发文量