用于60ghz纳米级VLSI电路互连耦合预测的宽带和spice兼容模型

2011 6th International Conference on Design & Technology of Integrated Systems in Nanoscale Era (DTIS) Pub Date : 2011-04-06 DOI:10.1109/ICOM.2011.5995293

Yiorgos I. Bontzios, M. Dimopoulos, A. Dimitriadis, A. Hatzopoulos

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引用次数: 0

摘要

本文提出了一个与spice模拟器完全兼容的集总模型。该模型具有可扩展性和技术独立性，可以统一预测电容耦合和电感耦合效应。它通过两个商用电磁模拟器验证了高达60 GHz的频率。

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A wideband and SPICE-compatible model for interconnect coupling prediction in nanoscale VLSI circuits up to 60 GHz

A new lumped model fully compatible with SPICE-like simulators is proposed in this work. The model is scalable, technology independent and can unify predict both capacitive and inductive coupling effects. It is validated up to 60 GHz by means of two commercial EM simulators.

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来源期刊

2011 6th International Conference on Design & Technology of Integrated Systems in Nanoscale Era (DTIS)

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