波峰焊中焊膜对球化和带化的敏感性

2008 International Students and Young Scientists Workshop - Photonics and Microsystems Pub Date : 2008-06-20 DOI:10.1109/STYSW.2008.5164144

B. Platek, S. Tesarski

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引用次数: 2

摘要

本文的目的是研究无铅焊料、阻焊剂和水基助焊剂对波峰焊中的球团焊和带边焊的影响。介绍了两种焊阻剂在滚焊和带焊时的敏感性试验(试验一—浮锡法和试验二—润湿平衡法)和一种助焊剂固体的敏感性试验。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Susceptibility of solder masks on solderballing and webbing in wave soldering

The goal of current paper is to investigate the impact of lead-free solders, solder masks and fluxes based on water on solderballing and webbing in wave soldering. Two tests for susceptibility of solder mask on solderballing and webbing (test I - solder float method and test II - wetting balance method) and one test for flux solids are presented.

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2008 International Students and Young Scientists Workshop - Photonics and Microsystems

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