用原子建模方法研究浅结技术

Min Yu, Ru Huang, Xiaokang Shil, Huihui Jil, Xing Zhang, Yangyuan Wang, H. Oka
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引用次数: 0

摘要

原子建模已被应用于研究和模拟先进的结技术。本文介绍了分子动力学方法在低能离子注入模拟中的应用和动力学蒙特卡罗方法在退火过程中增强扩散模拟中的应用。对剂量依赖性超低能注入进行了较好的模拟。模拟结果表明,能量污染并不像看上去那么严重。模拟了40kev和5kev Si注入情况下Si扩展缺陷的耗散。模拟了增强扩散。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Studying shallow junction technology by atomistic modeling
Atomistic modeling has been applied in studying and simulating the advanced junction technologies. We present in this paper the application of molecular dynamics method in simulation of low energy ion implantation and that of kinetic Monte Carlo method in simulation of enhanced diffusion in annealing. The dose dependent ultra-low energy implantation is well simulated. The simulation indicates that energy contamination is not as serious as it looks. The dissipation of Si extended defects are simulated for both 40 keV and 5 keV Si implantation cases. Enhanced diffusion is simulated.
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