新型八面体开槽金属轨道的仿真表征

2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2013-04-14 DOI:10.1109/EUROSIME.2013.6529907

J. Kludt, K. Weide-Zaage, M. Ackermann, V. Hein

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引用次数: 4

摘要

在高温和高电流应用的集成电路中需要高度坚固的金属化。通常被称为“动力金属”的特殊厚金属层被添加以实现更高的电流能力。但是这些金属化也受到可靠性的限制。因此，为0.35μm铝CMOS工艺创建了一种新的“动力金属”设计。本文研究了一种新型电力金属结构的可靠性问题。通过模拟确定了热电和热机械行为。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Characterization of a new designed octahedron slotted metal track by simulations

Highly robust metallizations in ICs for high temperature and high current applications are needed. Special thick metal layers often known as “power metals” are added to achieve a higher current capability. But these metallizations suffer from reliability limitations as well. Therefore a new design for “power metals” was created for a 0.35μm aluminium CMOS process. The reliability of a new power metal structure is investigated in this article. A determination of the thermal-electrical and thermo-mechanical behaviour is carried out by simulations.

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来源期刊

2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

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