基于低转移复用LFSR的三维堆叠集成电路测试调度

Bandi Divya, N. Mohan
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引用次数: 2

摘要

测试调度是减少3D堆叠ic测试时间的主要瓶颈,因为可以在粘合前测试中同时应用的测试可能由于粘合后测试中迫在眉睫的资源限制而不得不在不同的周期中应用。本文提出了一种可重复使用的3D堆叠集成电路低跃迁测试技术,该技术可以同时调度键合前和键合后的测试。此外,采用改进的Skyline算法进一步组织测试。完整的测试调度框架应用于各种ISCAS-85和89基准电路。从结果可以看出,BIST框架中使用的伪随机发生器是由重种子比特交换LFSR (RBS-LFSR)驱动的,这使得电路的开关功耗降低了25%。在不同的操作模式下,对BIST设计进行了验证,发现由BIST引起的面积和功率开销可以忽略不计。使用改进的Skyline算法,测试时间大约减少了29%。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Test Scheduling for Low Transition Reusable LFSR based BIST in 3-D Stacked ICs
Test Scheduling is a major bottleneck in reducing the test time for 3D stacked ICs, as the test which can be applied simultaneously in pre-bond testing may have to be applied in a different cycle due to the impending resource constraint in the post-bond testing. In this paper, a reusable Low transition BIST for 3D stacked ICs are proposed which can schedule the tests in both pre-bond and post-bond testing. Furthermore, an Improved Skyline Algorithm is used to further organize the tests. The complete test scheduling framework was applied to various ISCAS-85 and 89 benchmark circuits. From the results, it could be observed that the pseudo-Random Generator used in BIST framework is driven by Reseeded-Bit-Swapping LFSR (RBS-LFSR) which has reduced the amount of switching power dissipated from the circuit up to 25%. The BIST designs were validated at different modes of operation and the area, power overhead due to BIST is found to be negligible. With the use of Modified Skyline Algorithm the test time approximately reduced up to 29%.
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