{"title":"使用SMT、COB和/或TAB封装技术时的设计权衡","authors":"Elliott H. Newcombe","doi":"10.1109/IEMT.1992.639917","DOIUrl":null,"url":null,"abstract":"With increasing market pressure to provide electronic products with more functionality while, at the same time, reducing the overall product form factor, future product designs will require the highest density packaging technologies available. Currently,, there are several suitable technologies available such as fine-pitch SMT, Chip-on-Board (COB), and Tape Automated Bonding (TAB), but making the decision on which to use is not always easy. There are many variables to consider that are related to the requirements of the endproduct, including product form factor, reliability, service and maintenance, unit cast, and testing, to name a few. The purpose of this paper is to review some of the advanced packaging technologies available and understand the design tradeoffs associated with each.","PeriodicalId":403090,"journal":{"name":"Thirteenth IEEE/CHMT International Electronics Manufacturing Technology Symposium","volume":"12 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Design Tradeoffs When Using SMT, COB, And/or TAB packaging Technology\",\"authors\":\"Elliott H. Newcombe\",\"doi\":\"10.1109/IEMT.1992.639917\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"With increasing market pressure to provide electronic products with more functionality while, at the same time, reducing the overall product form factor, future product designs will require the highest density packaging technologies available. Currently,, there are several suitable technologies available such as fine-pitch SMT, Chip-on-Board (COB), and Tape Automated Bonding (TAB), but making the decision on which to use is not always easy. There are many variables to consider that are related to the requirements of the endproduct, including product form factor, reliability, service and maintenance, unit cast, and testing, to name a few. The purpose of this paper is to review some of the advanced packaging technologies available and understand the design tradeoffs associated with each.\",\"PeriodicalId\":403090,\"journal\":{\"name\":\"Thirteenth IEEE/CHMT International Electronics Manufacturing Technology Symposium\",\"volume\":\"12 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1900-01-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Thirteenth IEEE/CHMT International Electronics Manufacturing Technology Symposium\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IEMT.1992.639917\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Thirteenth IEEE/CHMT International Electronics Manufacturing Technology Symposium","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IEMT.1992.639917","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Design Tradeoffs When Using SMT, COB, And/or TAB packaging Technology
With increasing market pressure to provide electronic products with more functionality while, at the same time, reducing the overall product form factor, future product designs will require the highest density packaging technologies available. Currently,, there are several suitable technologies available such as fine-pitch SMT, Chip-on-Board (COB), and Tape Automated Bonding (TAB), but making the decision on which to use is not always easy. There are many variables to consider that are related to the requirements of the endproduct, including product form factor, reliability, service and maintenance, unit cast, and testing, to name a few. The purpose of this paper is to review some of the advanced packaging technologies available and understand the design tradeoffs associated with each.
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