千兆赫封装和电路板中多平面频率响应的计算

IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412) Pub Date : 1999-10-25 DOI:10.1109/EPEP.1999.819216

Jinseong Choi, M. Swaminathan

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引用次数: 14

摘要

本文讨论了一种计算多层封装和电路板中平面对堆叠频率响应的简单而有效的方法。该方法适用于集肤效应近似有效的高速数字系统。结果与s参数测量结果进行了比较，在50 MHz-1 GHz频率范围内显示出良好的相关性。还计算了去耦电容对频率响应的影响。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Computation of the frequency response of multiple planes in gigahertz packages and boards

This paper discusses a simple and efficient method for computing the frequency response of a plane pair stack-up in multi-layered packages and boards. This method is suitable for high speed digital systems where the skin effect approximation is valid. The results have been compared to S-parameter measurements and show good correlation in the frequency range 50 MHz-1 GHz. The effects of decoupling capacitors on the frequency response have also been computed.

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IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412)

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