{"title":"用于电活性植入物的封装热电发生器的参数化仿真","authors":"Y. Rao, S. Bouhedma, T. Bechtold, D. Hohlfeld","doi":"10.1109/EuroSimE52062.2021.9410874","DOIUrl":null,"url":null,"abstract":"This work investigates the performance of an implantable packaged thermoelectric generator (TEG) through parametric simulation. A finite element model is proposed, where a packaged TEG is embedded into the human tissue. After thermal resistance matching of the TEG with the surrounding tissue, an optimized size is found for the thermopiles to provide maximum power. The influence of implant position and its housing geometry on TEG performance is simulated. We found that in a promising implant position a TEG of $20 \\times 20$ mm2 size can provide $160 \\mu \\mathrm{W}$ power in a matched resistive load.","PeriodicalId":198782,"journal":{"name":"2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"50 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2021-04-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Parametric Simulation of a Packaged Thermoelectric Generator for Electrically Active Implants\",\"authors\":\"Y. Rao, S. Bouhedma, T. Bechtold, D. Hohlfeld\",\"doi\":\"10.1109/EuroSimE52062.2021.9410874\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This work investigates the performance of an implantable packaged thermoelectric generator (TEG) through parametric simulation. A finite element model is proposed, where a packaged TEG is embedded into the human tissue. After thermal resistance matching of the TEG with the surrounding tissue, an optimized size is found for the thermopiles to provide maximum power. The influence of implant position and its housing geometry on TEG performance is simulated. We found that in a promising implant position a TEG of $20 \\\\times 20$ mm2 size can provide $160 \\\\mu \\\\mathrm{W}$ power in a matched resistive load.\",\"PeriodicalId\":198782,\"journal\":{\"name\":\"2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)\",\"volume\":\"50 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2021-04-19\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EuroSimE52062.2021.9410874\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EuroSimE52062.2021.9410874","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Parametric Simulation of a Packaged Thermoelectric Generator for Electrically Active Implants
This work investigates the performance of an implantable packaged thermoelectric generator (TEG) through parametric simulation. A finite element model is proposed, where a packaged TEG is embedded into the human tissue. After thermal resistance matching of the TEG with the surrounding tissue, an optimized size is found for the thermopiles to provide maximum power. The influence of implant position and its housing geometry on TEG performance is simulated. We found that in a promising implant position a TEG of $20 \times 20$ mm2 size can provide $160 \mu \mathrm{W}$ power in a matched resistive load.