通过预测调整组件和系统资格测试

D. Braden, D. Harvey
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引用次数: 3

摘要

在汽车、军事和航空电子等高可靠性产品应用中,测试和验证的需求不断增长。这主要是由于车辆中安装的电子系统的使用和复杂性的增加,以及最终用户对可靠性的期望的提高。此外,产品开发周期不断缩短,导致进行加速寿命测试的可用时间减少。此外,测试持续时间的显著增加是可靠性期望提高的直接结果。汽车电子供应商尤其面临的挑战是在更短的时间内进行寿命测试,同时降低验证测试的总体相关成本。二分法是组件级别的可靠性测试不能复制预期的任务环境。这通常会导致组件供应商和最终用户之间的纠纷。许多元件供应商的重点是器件的热性能,但实际应用需要考虑其他因素,例如电路板制造和组装过程中的制造影响、机械应力和器件相互作用。此外,作者先前的工作表明,互连和系统级可靠性受到组件布局和约束点的显着影响,这些约束点是特定于应用的[1][2][3]。在本文中,对适当的预测技术进行了回顾,并提出了一种方法,其中组件级别的可靠性测试结果比系统级别的可靠性测试结果更接近。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Aligning component and system qualification testing through prognostics
There is a continual growth of test and validation in high reliability product applications such as automotive, military and avionics. Principally this is driven by increased use and complexity of electronic systems installed in vehicles in addition to increased end user reliability expectations. Furthermore product development cycles continue to reduce, resulting in less available time to perform accelerated life tests. Moreover, significant increases in test duration are observed as a direct result of raised reliability expectations. The challenge for automotive electronic suppliers in particular is performing life tests in shorter periods of time whilst reducing the overall associated costs of validation testing. The dichotomy is that reliability testing at the component level does not replicate the intended mission environment. Often this can result in disputes between component suppliers and end users. The focus for many component suppliers is on the thermal performance of devices, but real applications require other factors to be considered, such as manufacturing influences during circuit board manufacture and assembly, mechanical stresses and device interactions. Furthermore, previous work by the authors suggests that interconnect and system level reliability is significantly impacted by component layout and constraint points which are application specific [1] [2] [3]. In this paper, a review of suitable prognostic techniques is undertaken and an approach proposed in which reliability testing results at component level matches more closely that undertaken at system level.
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