多功能集成的三维MMIC技术及其在主片MMIC中的应用

IEEE 1996 Microwave and Millimeter-Wave Monolithic Circuits Symposium. Digest of Papers Pub Date : 1996-06-17 DOI:10.1109/MCS.1996.506309

T. Tokumitsu, K. Nishikawa, K. Kamogawa, I. Toyoda, M. Aikawa

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引用次数: 27

摘要

我们首先验证了与平面MMIC结构相比，使用三维MMIC结构可以很容易地将多功能MMIC的集成度提高三倍。该技术通过在3-D结构中加入两层研磨金属，在2/ sp1次/ 2mm的单足迹上构建高密度母片mmic。

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Three-dimensional MMIC technology for multifunction integration and its possible application to masterslice MMIC

We first verified that the integration level of multifunction MMICs can be easily increased three-fold by using three-dimensional (3-D) MMIC structure, in comparison to planar ones. The technology was used to build high-density masterslice MMICs on a single footprint in 2/spl times/2 mm by incorporating two levels of ground metals in the 3-D structure.

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IEEE 1996 Microwave and Millimeter-Wave Monolithic Circuits Symposium. Digest of Papers

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