螺位错影响下HTRB条件下4H-SiC MOS界面寿命建模

E. Brunt, D. Lichtenwalner, J. H. Park, S. Ganguly, J. McPherson
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摘要

本工作探讨了4H-SiC MOS界面在耗尽模式下的寿命模型和失效模式。与积累模式的TDDB不同,损耗模式的TDDB寿命较短,缺陷依赖性强。1/E模型可以很好地拟合观测到的TDDB寿命数据。尽管建模的生命周期比积累模式短,但对于应用程序部署来说,建模的生命周期是足够的。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Lifetime Modeling of the 4H-SiC MOS Interface in the HTRB Condition Under the Influence of Screw Dislocations
This work explores the lifetime model and failure modes of the 4H-SiC MOS interface in the depletion mode. Unlike accumulation mode TDDB, shorter lifetime and a strong defect dependence are observed in the depletion mode. The 1/E model is found to be a good fit for the observed TDDB lifetime data. Despite having a shorter lifetime than accumulation mode, the modeled lifetimes are sufficient for application deployment.
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