低成本,高性能射频基板

N. Santhanam
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引用次数: 5

摘要

在过去的50年里,随着电磁频谱中较低频段的迅速使用,无线应用的常用频率已经从500 MHz增加到77 GHz+。此外,在过去十年中,市场已经从主要的军事市场转变为100%的消费者驱动市场。这些因素,再加上竞争激烈的市场中更多的无线应用,产生了降低所有组件成本的需求。一个重点领域是层压板成本,以及PCB(印刷电路板)制造成本。设计师和层压板制造商与几家树脂制造商合作,一直在试验和设计各种基材,以降低总体成本。这些设计师和制造商取得了有限的成功,并不断遇到缺陷。本文着眼于一些不足,和一些神话,并试图回答这个问题:“真的有一个真正的低成本,微波和射频基板?”。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Low cost, high performance RF substrates
In the past 50 years, as the lower frequency bands in the electromagnetic spectrum have been rapidly used, the common frequencies for wireless applications have increased from 500 MHz to 77 GHz+. Also, in the last decade, the market has moved from a predominately military market, to a 100% consumer-driven market. These factors, in conjunction with several more wireless applications in a competitive marketplace, have created the need to reduce the cost of all components. One area of focus is the laminate cost, and the cost of PCB (printed circuit board) fabrication. Designers and laminate manufacturers, in collaboration with several resins manufacturers, have been experimenting with, and designing various substrates to reduce the overall cost. These designers and manufacturers have had limited success, and have constantly run into deficiencies. This paper looks at some of the deficiencies, and some of the myths, and attempts to answer the question: "is there is really a true low-cost, microwave and RF substrate?".
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