{"title":"低成本,高性能射频基板","authors":"N. Santhanam","doi":"10.1109/MTTTWA.1999.755130","DOIUrl":null,"url":null,"abstract":"In the past 50 years, as the lower frequency bands in the electromagnetic spectrum have been rapidly used, the common frequencies for wireless applications have increased from 500 MHz to 77 GHz+. Also, in the last decade, the market has moved from a predominately military market, to a 100% consumer-driven market. These factors, in conjunction with several more wireless applications in a competitive marketplace, have created the need to reduce the cost of all components. One area of focus is the laminate cost, and the cost of PCB (printed circuit board) fabrication. Designers and laminate manufacturers, in collaboration with several resins manufacturers, have been experimenting with, and designing various substrates to reduce the overall cost. These designers and manufacturers have had limited success, and have constantly run into deficiencies. This paper looks at some of the deficiencies, and some of the myths, and attempts to answer the question: \"is there is really a true low-cost, microwave and RF substrate?\".","PeriodicalId":261988,"journal":{"name":"1999 IEEE MTT-S International Topical Symposium on Technologies for Wireless Applications (Cat. No. 99TH8390)","volume":"48 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":"{\"title\":\"Low cost, high performance RF substrates\",\"authors\":\"N. Santhanam\",\"doi\":\"10.1109/MTTTWA.1999.755130\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In the past 50 years, as the lower frequency bands in the electromagnetic spectrum have been rapidly used, the common frequencies for wireless applications have increased from 500 MHz to 77 GHz+. Also, in the last decade, the market has moved from a predominately military market, to a 100% consumer-driven market. These factors, in conjunction with several more wireless applications in a competitive marketplace, have created the need to reduce the cost of all components. One area of focus is the laminate cost, and the cost of PCB (printed circuit board) fabrication. Designers and laminate manufacturers, in collaboration with several resins manufacturers, have been experimenting with, and designing various substrates to reduce the overall cost. These designers and manufacturers have had limited success, and have constantly run into deficiencies. This paper looks at some of the deficiencies, and some of the myths, and attempts to answer the question: \\\"is there is really a true low-cost, microwave and RF substrate?\\\".\",\"PeriodicalId\":261988,\"journal\":{\"name\":\"1999 IEEE MTT-S International Topical Symposium on Technologies for Wireless Applications (Cat. No. 99TH8390)\",\"volume\":\"48 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1900-01-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"5\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"1999 IEEE MTT-S International Topical Symposium on Technologies for Wireless Applications (Cat. No. 99TH8390)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/MTTTWA.1999.755130\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"1999 IEEE MTT-S International Topical Symposium on Technologies for Wireless Applications (Cat. No. 99TH8390)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MTTTWA.1999.755130","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
In the past 50 years, as the lower frequency bands in the electromagnetic spectrum have been rapidly used, the common frequencies for wireless applications have increased from 500 MHz to 77 GHz+. Also, in the last decade, the market has moved from a predominately military market, to a 100% consumer-driven market. These factors, in conjunction with several more wireless applications in a competitive marketplace, have created the need to reduce the cost of all components. One area of focus is the laminate cost, and the cost of PCB (printed circuit board) fabrication. Designers and laminate manufacturers, in collaboration with several resins manufacturers, have been experimenting with, and designing various substrates to reduce the overall cost. These designers and manufacturers have had limited success, and have constantly run into deficiencies. This paper looks at some of the deficiencies, and some of the myths, and attempts to answer the question: "is there is really a true low-cost, microwave and RF substrate?".