关注周期时间vs。-工具使用与材料处理方法的“悖论”

G. Horn, W. Podgorski
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引用次数: 15

摘要

从大规模工厂模拟中,半导体制造过程的特点是平均工厂周期时间与总体平均刀具利用率之间存在固定的非线性关系。这允许选择一个参数,从而决定了特定工厂的另一个参数。虽然在局部水平上,周期时间和工具使用之间的关系是通过排队理论来预测的,但我们在整个大型工厂中发现了类似的结果。在这种规模下,这种关系是矛盾的,因为它不允许同时使用较短的平均周期时间和较高的平均工具使用率。工厂绩效的净改善只能通过将这种关系移动到一条平行曲线上,在周期时间和工具利用率方面更有利,这需要从根本上改变系统。这种转变的重点目前集中在本地同步资产使用的方法上。然而,本文考虑的是集合工厂,其中局部资产使用仅由工厂的随机影响决定。局部资产被认为具有理想的效率,因此只有随机工厂关系决定其绩效。这些外部影响包括在制品的可用性、在制品的面额和在制品率。从这个全局工厂的角度来看,在制品处理方法对整体性能具有一阶影响,这促进了从一个工厂特征曲线到一个更高性能曲线的纯粹通过物料处理变化的迁移。采用0.5 s分辨率的动态离散事件模拟方法,研究了输运方法对整个系统的一阶影响。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A focus on cycle time-vs.-tool utilization "paradox" with material handling methodology
From large scale factory simulation, the semiconductor manufacturing process is characterized by a fixed nonlinear relationship between mean factory cycle time and overall average tool utilization. This allows selection of one parameter, which thus determines the other, for a specific factory. Although on a local level, the relationship between cycle time and tool usage is predicted via queuing theory, we find similar results for the entire large scale factory. On this scale, the relationship is paradoxical as it does not allow short mean cycle times and high average tool usage concurrently. Net improvements in factory performance can be had only by moving this relationship to a parallel curve, more favorable in the cycle time vs. tool utilization domain, which requires fundamental system changes. Emphasis on such shifts currently focuses on methodologies locally synchronizing asset use. This paper, however, considers the aggregate factory, where local asset usage is determined only by the random influence of the factory. Local assets are considered to have ideal efficiency, and thus only the stochastic factory relations determine their performance. Such external influences are WIP availability, WIP denomination and WIP rate. With this global factory view, WIP handling methodologies have a first order effect on overall performance, which promote migration from one factory characteristic curve to a higher performance one purely through material handling changes. Dynamic discrete event simulation, with 0.5 s resolution of WIP tracking, is used to find first order effects of transport methodologies on the total system.
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