低导通电压AlGaN/GaN SBD设计

Lifang Jia, Zhi He, Yanan Liang, Zhongchao Fan, Yun Zhang, Fuhua Yang, Junxi Wang
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引用次数: 0

摘要

由于高肖特基势垒高度,传统的AlGaN/GaN SBD具有较大的导通电压。本文实现了一种低导通电压级联编码AlGaN/GaN SBD Si。设计中使用了商用60 V Si SBD和高压AlGaN/GaN HEMT (>700 V)。共封装后器件的导通电压为0.26 V,击穿电压最高可达800 V。级联编码AlGaN/GaN SBD的反向恢复时间约为37.8 nS,与600 V商用SiC SBD基本相同。由于级联码AlGaN/GaN SBD在成本上明显优于SiC SBD,因此结果表明,这种AlGaN/GaN SBD可能会为某些电源管理应用领域提供潜在的解决方案。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Low turn-on voltage AlGaN/GaN SBD designed by cascode
Due to the high Schottky barrier height, traditional AlGaN/GaN SBD always has large turn-on voltage. In this paper, a low turn-on voltage cascode AlGaN/GaN SBD Si realized. A commercial 60 V Si SBD and a high voltage AlGaN/GaN HEMT (>700 V) were used in the design. After co-packaged, the device shows a turn-on voltage with 0.26 V and the breakdown voltage can reach up to 800 V. The reversed recovery time of the cascode AlGaN/GaN SBD is about 37.8 nS, which almost the same with the 600 V commercial SiC SBD. Since the cascode AlGaN/GaN SBD has an obviously advantage on cost over SiC SBD, the results indicate that such a AlGaN/GaN SBD may come to provide a potential solution to some field of power management applications.
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