Ushasree Katakamsetty, Stefan Nikolaev Voykov, B. Vasilev, S. Nakagawa, T. Tugbawa, Jansen Chee, A. Gower-Hall, Brian Lee, Weiyang Zhu, Bifeng Li, Kimiko Ichikawa
{"title":"生产线后端化学机械抛光过程的集成晶圆和模具级仿真","authors":"Ushasree Katakamsetty, Stefan Nikolaev Voykov, B. Vasilev, S. Nakagawa, T. Tugbawa, Jansen Chee, A. Gower-Hall, Brian Lee, Weiyang Zhu, Bifeng Li, Kimiko Ichikawa","doi":"10.1109/EDTM55494.2023.10103106","DOIUrl":null,"url":null,"abstract":"The Chemical Mechanical Polishing (CMP) variation on a die is a function of the die's location on the wafer [1]. Consequently, the number of CMP hotspots and the hotspot locations can vary from die-to-die on a given wafer. In this paper, we demonstrate the accuracy of Cadence's integrated wafer and die level CMP model in predicting the CMP variation on multiple dies across product chip wafers.","PeriodicalId":418413,"journal":{"name":"2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)","volume":"34 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2023-03-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Integrated Wafer and Die Level Simulation of Back End of Line Chemical Mechanical Polishing Processes\",\"authors\":\"Ushasree Katakamsetty, Stefan Nikolaev Voykov, B. Vasilev, S. Nakagawa, T. Tugbawa, Jansen Chee, A. Gower-Hall, Brian Lee, Weiyang Zhu, Bifeng Li, Kimiko Ichikawa\",\"doi\":\"10.1109/EDTM55494.2023.10103106\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The Chemical Mechanical Polishing (CMP) variation on a die is a function of the die's location on the wafer [1]. Consequently, the number of CMP hotspots and the hotspot locations can vary from die-to-die on a given wafer. In this paper, we demonstrate the accuracy of Cadence's integrated wafer and die level CMP model in predicting the CMP variation on multiple dies across product chip wafers.\",\"PeriodicalId\":418413,\"journal\":{\"name\":\"2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)\",\"volume\":\"34 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2023-03-07\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EDTM55494.2023.10103106\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EDTM55494.2023.10103106","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Integrated Wafer and Die Level Simulation of Back End of Line Chemical Mechanical Polishing Processes
The Chemical Mechanical Polishing (CMP) variation on a die is a function of the die's location on the wafer [1]. Consequently, the number of CMP hotspots and the hotspot locations can vary from die-to-die on a given wafer. In this paper, we demonstrate the accuracy of Cadence's integrated wafer and die level CMP model in predicting the CMP variation on multiple dies across product chip wafers.
求助内容：
应助结果提醒方式：
京公网安备 11010802042870号
