{"title":"一种低成本高增益天线阵列及其与有源电路的集成","authors":"Sanming Hu, Y. Xiong, Lei Wang, Debin Hou, T. Lim","doi":"10.1109/EDAPS.2010.5683020","DOIUrl":null,"url":null,"abstract":"At millimeter-wave frequencies, high-gain antenna and its integration with active circuits are of great concern. In this paper, a 2×4 antenna array is designed and fabricated on printed circuit board (PCB). At 135 GHz, the maximum gain is 15.4 dBi. It is much higher than that of a conventional on-chip antenna which is usually lower than −10 dBi. Subsequently, the low-cost wire-bonding technology is studied and adopted to integrate this array with active circuits.","PeriodicalId":185326,"journal":{"name":"2010 IEEE Electrical Design of Advanced Package & Systems Symposium","volume":"6 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2010-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"8","resultStr":"{\"title\":\"A low-cost high-gain antenna array and its integration with active circuits\",\"authors\":\"Sanming Hu, Y. Xiong, Lei Wang, Debin Hou, T. Lim\",\"doi\":\"10.1109/EDAPS.2010.5683020\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"At millimeter-wave frequencies, high-gain antenna and its integration with active circuits are of great concern. In this paper, a 2×4 antenna array is designed and fabricated on printed circuit board (PCB). At 135 GHz, the maximum gain is 15.4 dBi. It is much higher than that of a conventional on-chip antenna which is usually lower than −10 dBi. Subsequently, the low-cost wire-bonding technology is studied and adopted to integrate this array with active circuits.\",\"PeriodicalId\":185326,\"journal\":{\"name\":\"2010 IEEE Electrical Design of Advanced Package & Systems Symposium\",\"volume\":\"6 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2010-12-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"8\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2010 IEEE Electrical Design of Advanced Package & Systems Symposium\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EDAPS.2010.5683020\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2010 IEEE Electrical Design of Advanced Package & Systems Symposium","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EDAPS.2010.5683020","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A low-cost high-gain antenna array and its integration with active circuits
At millimeter-wave frequencies, high-gain antenna and its integration with active circuits are of great concern. In this paper, a 2×4 antenna array is designed and fabricated on printed circuit board (PCB). At 135 GHz, the maximum gain is 15.4 dBi. It is much higher than that of a conventional on-chip antenna which is usually lower than −10 dBi. Subsequently, the low-cost wire-bonding technology is studied and adopted to integrate this array with active circuits.
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