三维聚焦离子束(FIB)蚀刻技术在纳米和微技术中的应用

Digest of Papers. Microprocesses and Nanotechnology 2001. 2001 International Microprocesses and Nanotechnology Conference (IEEE Cat. No.01EX468) Pub Date : 2001-10-31 DOI:10.1109/IMNC.2001.984055

S. Kim, T. Yamashita, K. Lee, M. Nagao, M. Sato, H. Maeda

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引用次数: 3

摘要

我们开发了一种基于纳米和微技术的三维FIB蚀刻方法，用于制造三维微器件和传感器。我们在Bi-2201单晶晶须上制备了单电子隧穿(SET)器件。以层状单晶晶须为例，描述了三维FIB刻蚀方法。这些方法在FIB系统中提供了简单的原位蚀刻和蒸发过程，用于制造微区域的堆叠。

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Development of 3-D focused-ion-beam (FIB) etching methods for nano- and micro-technology application

We have developed a 3-D FIB etching method for making 3-D micro-devices and sensors based on nano- and micro-technology. We fabricated single electron tunneling (SET) devices on a Bi-2201 single crystal whisker. We also describe 3-D FIB etching methods using layered single crystal whiskers as examples. These methods offer simple in situ etching and evaporation processes in FIB systems for making a micro area of stacks.

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Digest of Papers. Microprocesses and Nanotechnology 2001. 2001 International Microprocesses and Nanotechnology Conference (IEEE Cat. No.01EX468)

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