H. Xu, C. Liu, V. Silberschmidt, Z. Chen, M. Sivakumar
{"title":"铝金属化表面热超声金丝键合的TEM界面特征","authors":"H. Xu, C. Liu, V. Silberschmidt, Z. Chen, M. Sivakumar","doi":"10.1109/EPTC.2009.5416495","DOIUrl":null,"url":null,"abstract":"A native alumina thin film existing on aluminium and its evolution in thermosonic gold wire bonding were characterized using high resolution transmission electron microscopy (HR TEM). It has been found that the partly fracture of this alumina film by the ultrasonic vibration allows the interdiffusion at the Au/Al interface, such that the intermetallic compounds (IMCs) are formed. The IMCs are identified as Au4Al and AuAl2 with a thickness of approximately 300 nm. With a higher ultrasonic energy, IMCs are formed in more contact areas, resulting in a stronger bond. Based on these experimental results, a mechanism of ultrasonic gold wire bonding is proposed, which helps to understand the correlation among ultrasonic energy, interfacial structure and bonding strength.","PeriodicalId":256843,"journal":{"name":"2009 11th Electronics Packaging Technology Conference","volume":"108 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2009-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"TEM interfacial characteristics of thermosonic gold wire bonding on aluminium metallization\",\"authors\":\"H. Xu, C. Liu, V. Silberschmidt, Z. Chen, M. Sivakumar\",\"doi\":\"10.1109/EPTC.2009.5416495\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A native alumina thin film existing on aluminium and its evolution in thermosonic gold wire bonding were characterized using high resolution transmission electron microscopy (HR TEM). It has been found that the partly fracture of this alumina film by the ultrasonic vibration allows the interdiffusion at the Au/Al interface, such that the intermetallic compounds (IMCs) are formed. The IMCs are identified as Au4Al and AuAl2 with a thickness of approximately 300 nm. With a higher ultrasonic energy, IMCs are formed in more contact areas, resulting in a stronger bond. Based on these experimental results, a mechanism of ultrasonic gold wire bonding is proposed, which helps to understand the correlation among ultrasonic energy, interfacial structure and bonding strength.\",\"PeriodicalId\":256843,\"journal\":{\"name\":\"2009 11th Electronics Packaging Technology Conference\",\"volume\":\"108 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2009-12-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2009 11th Electronics Packaging Technology Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPTC.2009.5416495\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2009 11th Electronics Packaging Technology Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPTC.2009.5416495","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
TEM interfacial characteristics of thermosonic gold wire bonding on aluminium metallization
A native alumina thin film existing on aluminium and its evolution in thermosonic gold wire bonding were characterized using high resolution transmission electron microscopy (HR TEM). It has been found that the partly fracture of this alumina film by the ultrasonic vibration allows the interdiffusion at the Au/Al interface, such that the intermetallic compounds (IMCs) are formed. The IMCs are identified as Au4Al and AuAl2 with a thickness of approximately 300 nm. With a higher ultrasonic energy, IMCs are formed in more contact areas, resulting in a stronger bond. Based on these experimental results, a mechanism of ultrasonic gold wire bonding is proposed, which helps to understand the correlation among ultrasonic energy, interfacial structure and bonding strength.
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